Display Test Pad Routing for Uniform Lighting Inspection Signals

The patent divides the connection structure into multiple segments: a first line extending in a first direction, a second line extending in a second direction, and connection lines connecting them. The test transistors are connected to the first line, while the test pad is connected to the second line through the connection lines. This segmentation allows the signal to be transmitted uniformly to all test transistors through the distributed connection structure, resolving the contradiction between structural simplicity and inspection accuracy.

The patent introduces a dimensional change by extending the connection structure from a single-line configuration to a two-dimensional grid-like arrangement. The first line and second line extend in different directions (first direction and second direction respectively), creating a spatial distribution that ensures uniform signal transmission to all test transistors, thereby improving measurement precision without significantly increasing overall device complexity.

The connection structure is segmented into multiple functional parts: the first line for transistor connections, the second line for test pad connections, and the connection lines as intermediaries. This segmentation maintains ease of manufacture by allowing modular assembly while ensuring reliable defect detection through uniform signal distribution to all test transistors via the distributed connection architecture.

The connection lines serve as intermediary elements between the first line (connected to test transistors) and the second line (connected to test pad). These intermediaries ensure that electrical signals are transmitted uniformly and reliably to all test transistors, improving defect detection reliability while maintaining manufacturing simplicity through standardized connection structures.

The patent transitions from a one-dimensional single-line connection to a two-dimensional distributed connection structure. The first line extends in a first direction with test transistors connected along its length, while the second line extends in a second direction connected to the test pad. This dimensional expansion ensures uniform electrical signal transmission to all test transistors by distributing the signal path, achieving homogeneity without excessive complexity.

The connection structure implements local quality by providing different connection characteristics at different locations. The first line provides local connections to test transistors at various positions along the first direction, while the second line provides the terminal connection to the test pad along the second direction. This localized optimization ensures uniform signal transmission to all transistors while maintaining overall structural efficiency.