Display Pad Structure With Insulating Layer to Prevent Shorts

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Solution Overview

Problem

During the rework process of display devices, the shapes of pads can be deformed, leading to potential short defects between pads due to pushed conductive patterns.

Innovation Solution

The display device incorporates a substrate with a pad area featuring a first conductive pattern, an insulating layer overlapping the conductive pattern, and second conductive patterns spaced apart and contacting the first conductive pattern through diagonal contact holes, minimizing deformation and preventing short defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the pads are bonded to the circuit board using pressure and adhesive, then the pads can transmit signals and voltages, but the conductive patterns may be pushed and deformed during rework, causing short defects

Engineering Contradiction:
Improvebonding reliabilityVSAvoidpad shape precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The pad structure is segmented into multiple conductive patterns (first, second, and third conductive patterns) separated by insulating layers. This segmentation prevents the conductive patterns from pushing against each other during rework, eliminating the short defect issue while maintaining bonding reliability through the distributed contact points.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An insulating layer is introduced as an intermediary between the first conductive pattern and the second conductive pattern. This insulating layer prevents direct contact between conductive patterns, stopping the propagation of deformation and preventing short circuits during the rework process.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If the conductive patterns are placed close together to reduce area, then the device area is minimized, but the risk of short defects increases when conductive patterns contact during rework

Engineering Contradiction:
Improvepad areaVSAvoidshort defect prevention
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The insulating layer acts as a mediator that allows conductive patterns to be placed in close proximity while preventing electrical contact between them. This enables area minimization without increasing short defect risk, as the insulating layer maintains electrical isolation even when patterns are physically close.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution moves the isolation mechanism from the planar dimension to the vertical dimension by stacking insulating layers between conductive patterns. This allows conductive patterns to be closely spaced in the plane while maintaining separation through the thickness direction, achieving both area minimization and short defect prevention.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If multiple conductive patterns are stacked to achieve electrical connection, then the electrical connectivity is improved, but the complexity of the pad structure increases

Engineering Contradiction:
Improveelectrical connectivityVSAvoidpad structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The electrical connection is segmented into multiple discrete conductive patterns stacked in layers rather than using a single complex continuous pattern. Each layer serves a specific electrical function, and the segmentation allows for simpler individual patterns that are easier to manufacture and inspect while achieving the required connectivity.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12295225B2Display device
Publication Date: 2025.05.06 SAMSUNG DISPLAY CO LTD
  • US12295225B2 patent drawing
  • US12295225B2 patent drawing
  • US12295225B2 patent drawing

AI summary

A display device includes a substrate including a pad area, a first conductive pattern disposed in the pad area on the substrate, an insulating layer disposed on the first conductive pattern and overlapping the first conductive pattern, second conductive patterns disposed on the insulating layer, spaced apart from each other, and contacting the first conductive pattern through contact holes formed in the insulating layer, and a third conductive pattern disposed on the second conductive patterns and contacting the insulating layer.