Connection Circuit Board Pad Structure for Narrow-Bezel Display Reliability
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Solution Overview
Problem
Existing display devices face challenges in reducing defects such as short circuits between pads, particularly in high-resolution displays, where the rigidity and bezel area of the display panel are critical for reliability and performance.
Innovation Solution
A display device design featuring a connection circuit board with specifically arranged pads and vertical arrangement pads that overlap and extend in particular directions, along with an additional power pad, to enhance signal transmission and reduce the likelihood of short circuits, while maintaining reliability and improving connection characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of pads is increased to support high resolution display, then the display resolution is improved, but the risk of short circuit between pads increases
Solution Approach 1:
The patent transitions from a single-row pad arrangement to a multi-dimensional pad layout with vertical arrangement pads extending in the second direction (crossing the first direction). This dimensional expansion allows signal routing in multiple directions, increasing spacing between pads in the primary arrangement direction while maintaining high resolution connectivity through the vertical dimension.
Solution Approach 2:
The pad structure is segmented into multiple functional groups: vertical arrangement pads (first, second, third) with distinct virtual lines, additional pads spaced apart, and connection parts separating pad parts. This segmentation creates electrical isolation between groups, reducing short circuit risk while maintaining comprehensive signal routing capability for high resolution displays.
2Area of stationary object
If pads are arranged closer together to reduce bezel area, then the bezel area is reduced, but the likelihood of short circuit between pads increases
Solution Approach 1:
By introducing vertical arrangement in the second direction (crossing the first direction), the patent enables compact horizontal spacing (reducing bezel area) while maintaining vertical separation between pad groups. The multi-directional arrangement allows dense packing without compromising inter-pad spacing in critical directions.
Solution Approach 2:
Different pad groups are assigned different spatial characteristics: vertical arrangement pads on separate virtual lines with specific spacing, additional pads positioned at greater distances, and connection parts creating local isolation zones. This local quality differentiation optimizes spacing locally to prevent short circuits while achieving overall compact design.
3Reliability
If the arrangement of pads is optimized for signal transmission, then the connection characteristics are improved, but the device complexity increases
Solution Approach 1:
The pad structure is divided into distinct functional segments: vertical arrangement pads for primary signal routing, additional pads for auxiliary connections, and connection parts for electrical isolation. Each segment has a defined role, simplifying the design process despite the overall complex arrangement, as each component can be optimized independently.
Solution Approach 2:
The multi-dimensional pad arrangement (vertical and horizontal directions) provides multiple routing paths for signals, improving connection reliability through redundancy and alternative pathways. This dimensional approach organizes complexity systematically rather than randomly, making the complex arrangement more manageable and designable.
Data Source
AI summary
A display device includes a display panel including an edge extending along a first direction, a main circuit board adjacent to the edge of the display panel, and a connection circuit board which connects the main circuit board to the display panel at the edge thereof. The connection circuit board includes a plurality of board side pads which are arranged along the first direction and at which the connection circuit board is connected to the main circuit board. Each of the plurality of board side pads includes a first pad, and a second pad adjacent to the first pad along the first direction. The second pad includes a plurality of signal pads which are arranged along a second direction which crosses the first direction and are each aligned with the first pad along the first direction.