Display Module Pad Layout for Shorter Wire Bonding
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Solution Overview
Problem
Existing display module manufacturing processes face challenges in process yield and reliability due to the mismatch in manufacturing accuracy between circuit boards and display substrates, leading to longer wire lengths and smaller bonding angles that compromise the wire bonding process.
Innovation Solution
The implementation of two rows of circuit board pads on a circuit board, with alternating arrangements and staggered configurations, allows for more concentrated pad placement, reducing the width of the bonding region and increasing the bonding angle, thereby enhancing the reliability of the wire bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional single-row circuit board pad arrangement is used, then the manufacturing process is simple, but the wire length is long and bonding angle is small, reducing process yield and reliability
Solution Approach 1:
The circuit board pads are divided into two rows instead of using a single row arrangement. This segmentation allows the pads to be distributed more compactly in the vertical direction, reducing the horizontal distance to substrate pads and thereby shortening wire length while improving bonding angle and reliability
Solution Approach 2:
The pad arrangement transitions from a single-row linear layout to a two-row spatial configuration. By utilizing the vertical dimension more effectively, the pads are positioned closer to the substrate pads, reducing wire length and improving bonding geometry without significantly increasing overall complexity
2Manufacturing precision
If circuit board pads are arranged further from substrate pads, then the bonding region width is larger, but the wire length increases and bonding angle decreases, compromising bonding quality
Solution Approach 1:
The two-row pad arrangement creates localized bonding regions with optimized geometry. Each pad position is strategically configured to achieve optimal bonding angle and minimal wire length, improving manufacturing precision at critical bonding locations without requiring uniform changes across the entire structure
Data Source
AI summary
A display module, a method for manufacturing the same, and a display device. The display module includes: a first bonding region of a circuit board is provided with a first row of circuit board pads and a second row of circuit board pads, and each row of circuit board pads comprises multiple circuit board pads arranged at intervals in a first direction; a second bonding region of the display substrate is provided with a plurality of substrate pads arranged in the first direction, an orthographic projection of the display substrate onto the circuit board does not overlap the first bonding region, and the second bonding region is close to the first bonding region. The circuit board pads are bonded to the substrate pads via suspended wires. The second row of circuit board pads comprises first circuit board pads and second circuit board pads.