Display Pad Wiring Layout to Prevent Contact Bridge Corrosion
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Solution Overview
Problem
In display devices, misalignment during the bonding of driving chips to pads can lead to damage of the organic insulating layer, allowing external impurities to enter and causing corrosion of the wiring, resulting in defects in vertical lines.
Innovation Solution
A display device design that includes an inorganic insulating layer, a pad, a contact bridge, an electrostatic electrode, and organic insulating layers, where the contact bridge is positioned farther from the end of the organic insulating layer, and an upper wiring overlaps the contact bridge and electrostatic electrode, thereby protecting the contact bridge from impurities and preventing wiring corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the organic insulating layer is cleaned during the rework process to remove damage, then the damaged layer is removed, but external impurities are introduced through the damaged layer causing wiring corrosion
Solution Approach 1:
An inorganic insulating layer is introduced as an intermediary barrier between the organic insulating layer and the wiring. This inorganic layer remains intact during the rework cleaning process, preventing impurities from reaching and corroding the wiring while allowing the damaged organic layer to be safely removed and replaced.
Solution Approach 2:
The inorganic insulating layer is formed beforehand to provide a protective cushion or barrier. This pre-formed protective layer ensures that even if the organic insulating layer is damaged during rework, the wiring is already protected from impurity infiltration, preventing corrosion before it can occur.
2Area of stationary object
If the contact bridge is positioned closer to the pad for compact design, then the device area is reduced, but the organic insulating layer becomes more vulnerable to damage during rework
Solution Approach 1:
The inorganic insulating layer serves as a protective intermediary that allows the contact bridge to be positioned closer to the pad for compact design. This mediator protects the vulnerable organic insulating layer in the compact configuration from damage during rework, enabling both compactness and reliability.
3Length of stationary object
If the organic insulating layer is made thinner to reduce device thickness, then the overall device thickness is reduced, but the layer becomes more susceptible to damage during bonding and rework processes
Solution Approach 1:
A composite insulating structure is created by combining the organic insulating layer with an inorganic insulating layer. This composite material approach allows the organic layer to be made thinner for reduced device thickness while the inorganic layer provides the necessary durability and damage resistance during bonding and rework processes.
Solution Approach 2:
The inorganic insulating layer acts as a mediator that protects the thin organic insulating layer from mechanical damage during manufacturing processes. This intermediary protection enables the use of thinner organic layers without sacrificing durability.
Data Source
AI summary
A display device includes a substrate including a display area and a non-display area, a first wiring at the non-display area, a second wiring on a layer that is different from the first wiring at the non-display area, an inorganic insulating layer on the first wiring and the second wiring, a pad on the inorganic insulating layer, and connected to a first end of the first wiring, a contact bridge on the inorganic insulating layer, and connecting the second wiring to a second end of the first wiring, an electrostatic electrode on the inorganic insulating layer between the pad and the contact bridge, a first organic insulating layer covering the contact bridge and the electrostatic electrode, and exposing the pad, a first upper wiring on the first organic insulating layer, and overlapping the contact bridge and the electrostatic electrode, and a second organic insulating layer on the first upper wiring.


