Display Pad Layout With Overlapping Signal Lines for Zero Bezel
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face challenges with disconnected pads and non-uniform application of side lines, leading to increased bezel area and reduced bezel area reduction in high-resolution displays.
Innovation Solution
The display device design includes overlapping upper pads with signal lines and transistors, utilizing side lines to connect pads and substrates, and employing a uniform side surface grinding process to minimize bezel area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pads are disposed separately from signal lines and transistors, then pad connection reliability is improved, but bezel area increases
Solution Approach 1:
The pad structure is merged with the signal line and transistor structures by disposing the pad to overlap with them in the plan view. This integration allows the pad to maintain electrical connection reliability while occupying space that would otherwise be part of the bezel area, thus reducing the overall bezel area of the display device.
Solution Approach 2:
The pad is extended in the vertical dimension (thickness direction) to overlap with the signal line and transistor in the plan view. This three-dimensional arrangement allows the pad to maintain its connection function while occupying overlapping space, effectively reducing the horizontal bezel area without compromising connection reliability.
2Ease of manufacture
If side lines are applied on oblique side surfaces, then manufacturing process is simplified, but material application uniformity deteriorates
Solution Approach 1:
The side surfaces of the substrate are ground to be substantially perpendicular to the upper surface before applying the side lines. This preliminary preparation of the substrate surface creates a uniform, vertical surface that facilitates even material application of the side lines, ensuring manufacturing precision while maintaining ease of manufacture.
3Area of stationary object
If upper pads overlap with signal lines and transistors, then bezel area is reduced, but manufacturing complexity increases
Solution Approach 1:
The pad structure is divided into multiple segments corresponding to different signal lines and transistors. Each pad segment is disposed to overlap with specific signal lines and transistors, allowing for modular manufacturing and assembly while achieving overall bezel area reduction. This segmentation manages the manufacturing complexity through systematic division of the integration task.
Data Source
AI summary
A display device includes a substrate on which a plurality of light-emitting elements is disposed; a transistor on the substrate; a plurality of signal lines on the substrate; a plurality of link lines below the substrate; and a plurality of upper pads on the substrate and connected to the plurality of signal lines, in which the plurality of upper pads is disposed to overlap with at least one of the plurality of signal lines and the plurality of transistors. Therefore, it is possible to implement the high-resolution display device with zero bezel by reducing the bezel area of the display device.


