Display Panel Conductive Adhesive Electrostatic Discharge
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Liquid crystal display devices are prone to electrostatic damage due to static electricity accumulation on insulating substrates, which can lead to screen defects, metal circuitry damage, and resistance changes, and existing methods like conductive adhesive tapes are costly and not suitable for devices with plastic frames or lack automation.
Innovation Solution
A display panel design with a counter substrate and array substrate where conductive adhesive is applied in specific zones to connect with an electrostatic conducting structure, allowing static electricity to be directed to a grounded unit, reducing manual labor and material costs through automated dispensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive adhesive tape is attached to lead out static electricity, then static electricity discharge is achieved, but manufacturing cost increases and automation is reduced
Solution Approach 1:
The patent combines the electrostatic discharge function with the existing sealing structure by integrating conductive adhesive into the sealing zone where the counter substrate contacts the array substrate. This merging eliminates the need for separate conductive adhesive tape while achieving the same electrostatic discharge purpose, thereby reducing manufacturing cost and enabling automation.
Solution Approach 2:
The sealing structure is given multiple functions: it simultaneously provides mechanical sealing and electrostatic discharge pathways. By making the sealing zone conductive through the conductive adhesive, the same structure serves dual purposes, reducing the need for additional components and simplifying the manufacturing process.
2Ease of manufacture
If conductive adhesive is applied in sealing zone, then electrostatic discharge is achieved with automated dispensing, but manufacturing precision requirements increase
Solution Approach 1:
The patent designs the sealing zone structure in advance to naturally guide and contain the conductive adhesive during the dispensing process. The pre-configured sealing geometry acts as a built-in mold that directs adhesive flow, ensuring proper placement without requiring high-precision dispensing control, thus enabling automated application.
Solution Approach 2:
The conductive adhesive is applied locally only in the sealing zone where it is needed for electrostatic discharge, rather than uniformly across the entire substrate. This localized application reduces the total amount of adhesive required and minimizes the impact of dispensing variations, making the process more tolerant and easier to automate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents electrostatic damage by timely discharge of static electricity, reduces costs, and is applicable to both metal and plastic frame devices, enhancing production efficiency and product reliability.
Implementation Method 1
an electrostatic conducting structure is provided on the counter substrate, and the conductive adhesive is electrically connected to the electrostatic conducting structure
Implementation Method 2
the timely lead-out of static electricity on a counter substrate in the display panel is realized to avoid the electrostatic damage
Data Source
AI summary
A display panel and manufacturing method thereof, and a display device are disclosed. The display panel includes an array substrate and a counter substrate. The array substrate includes a main region and a peripheral region, the main region coincides with an orthographical projection of the counter substrate on the array substrate, and at least one glue dispensing zone is arranged in the peripheral region or the main region. Conductive adhesive is provided in the glue dispensing zone, and is electrically connected to a grounded unit; an electrostatic conducting structure is provided on the counter substrate, and the conductive adhesive is electrically connected to the electrostatic conducting structure.