Display Panel Airflow Chassis Layout for Heat Dissipation
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Solution Overview
Problem
Electronic apparatuses experience increased internal temperatures due to heat generation during operation, leading to deterioration of components and reduced lifespan and display quality.
Innovation Solution
An electronic apparatus design featuring a chassis with openings and a cooling module that forms a cooling air current adjacent to the display panel, utilizing fans and a thermoelectric layer to dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the display panel and circuit board operate continuously, then productivity is improved, but temperature increases causing component deterioration and reduced reliability
Solution Approach 1:
The patent extracts heat from the display panel and circuit board by introducing a cooling air current that flows through a flow space adjacent to these components. The cooling module draws air through openings in the chassis, creating a dedicated cooling path that removes heat before it can accumulate and damage components, thereby enabling continuous operation without compromising reliability
Solution Approach 2:
The patent employs pneumatic cooling by using a cooling module (fan) to generate forced air flow through the flow space. The cooling air current is pumped through the chassis openings and across the display panel and circuit board, using fluid dynamics to transfer heat away from sensitive components and maintain operational reliability during continuous use
2Temperature
If heat dissipation structures are added to cool the display panel, then temperature control is improved, but device complexity increases
Solution Approach 1:
The chassis serves multiple functions: it provides structural support, defines the flow space for cooling air, and incorporates openings that facilitate heat dissipation. By making the chassis multi-functional rather than adding separate cooling structures, the patent achieves effective temperature control without significantly increasing device complexity
Solution Approach 2:
The patent merges the cooling function with the existing chassis structure by forming the flow space between the chassis and the display panel/circuit board. The chassis and cover are combined to create an integrated cooling pathway, eliminating the need for separate cooling components and reducing overall structural complexity while maintaining effective heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the lifespan and display quality by effectively cooling the display panel and circuit board, enhancing heat dissipation characteristics.
Implementation Method 1
a cooling module disposed on the second part... capable of forming a cooling air current in a flow space between the second part and the display panel
Implementation Method 2
a thermoelectric layer located between the display panel and the chassis, and adjacent to the display panel
Data Source
AI summary
Provided is an electronic apparatus including a display panel, a chassis including a first part disposed adjacent to the display panel, and a second part which is connected to the first part and is spaced apart by a predetermined distance from the display panel to define a flow space between the second part and the display panel, and in which a first opening and a second opening communicating with the flow space are defined, and a cooling module disposed inside or outside of the second part, wherein the second opening is located to be lower than a reference line passing through the center of the display panel.