Display Panel Alignment Pads for Precise Flexible Circuit Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face challenges in ensuring reliable alignment and durability during the bonding process of flexible circuit boards with display panels, particularly in flexible display technologies.
Innovation Solution
The display device incorporates specific pad configurations on the display panel and flexible circuit board, including panel and circuit alignment pads, to facilitate precise alignment measurement and improved bonding, enhancing durability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If alignment pads are added to measure alignment during bonding, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The alignment pad is divided into multiple segments (first alignment pad and second alignment pad) positioned at different locations on the display panel and flexible circuit board. This segmentation allows independent optimization of each pad's position and size for alignment measurement while maintaining overall system functionality.
Solution Approach 2:
The alignment pads are pre-configured on both the display panel and flexible circuit board before the bonding process. This preliminary setup enables alignment measurement to be performed automatically during or after bonding without requiring additional measurement equipment or complex post-processing procedures.
2Strength
If flexible circuit board is pressed during bonding, then bonding strength is improved, but alignment accuracy deteriorates
Solution Approach 1:
The alignment pads are positioned and configured before the pressing operation, serving as reference markers that define the desired alignment state. This preliminary configuration allows the bonding process to proceed with pressing while maintaining alignment accuracy through the pre-established pad positions.
Solution Approach 2:
The alignment pads provide visual or positional feedback during the bonding process, enabling real-time monitoring and adjustment of alignment status. This feedback mechanism allows operators to verify alignment accuracy even after pressing, ensuring both bonding strength and alignment precision are achieved.
Data Source
AI summary
A display device includes a display panel including panel pads at least partially extending in a first direction and arranged in a second direction and a flexible circuit board including circuit pads electrically connected to the panel pads. The panel pads include display pads and at least one panel alignment pad spaced apart from the plurality of display pads in the second direction. The circuit pads include functional pads respectively electrically connected to the plurality of display pads and at least one circuit alignment pad extending in the first direction and spaced apart from the functional pads in the second direction. The circuit alignment pad includes a first portion and a second portion spaced apart from the first portion in the first direction to form a separation portion. The at least one panel alignment pad overlaps the separation portion between the first portion and the second portion.