Display Panel Back Plate Wiring for Narrow-Bezel Manufacturing
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Solution Overview
Problem
Traditional methods for manufacturing frameless or narrow-frame display panels are complex and prone to issues like short-circuits, substrate stiffness reduction, and abnormal alignment due to the diffusion and penetration of silver ions, leading to low yield and high costs.
Innovation Solution
A manufacturing method involving a metal film and a back plate with soldering aid layers doped with conductive particles, where the metal film is hot-pressed to form welding portions connecting to wires, then bent and patterned to form second wires, eliminating the need for side printing or physical vapor deposition processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If side printing process or side physical vapor deposition process is used to form conductive layer, then frameless or narrow-frame effect is achieved, but process complexity increases and manufacturing precision requirements become very high
Solution Approach 1:
The patent extracts the problematic side printing or side physical vapor deposition processes from the manufacturing flow and replaces them with conventional top-side processes. The conductive layer is formed on the top surface of the substrate using standard techniques, eliminating the need for complex side bonding operations while achieving the same electrical connection function.
Solution Approach 2:
Instead of forming conductive layers on the side of the substrate as in traditional methods, the patent inverts the approach by forming the conductive layer on the top surface of the substrate. This inversion simplifies the manufacturing process while maintaining the frameless or narrow-frame display effect.
2Reliability
If side printing or side physical vapor deposition is used, then conductive layer is formed, but manufacturing precision requirement becomes very high leading to abnormal alignment
Solution Approach 1:
The patent removes the high-precision side printing or side physical vapor deposition steps from the process and replaces them with conventional top-side conductive layer formation methods. This extraction eliminates the alignment precision problems associated with side bonding while maintaining electrical connectivity.
3Shape
If laser cutting process is used to pattern conductive layer, then frameless effect is achieved, but substrate stiffness is reduced due to diffusion and penetration of silver ions
Solution Approach 1:
The patent extracts the laser cutting process that causes silver ion diffusion and substrate degradation from the manufacturing flow. Instead, conventional patterning methods are used on the top surface, eliminating the harmful thermal effects on the substrate while maintaining the frameless display configuration.
4Shape
If complex side bonding process is used, then narrow frame or frameless is achieved, but yield becomes low and cost becomes high
Solution Approach 1:
The patent removes the complex side bonding process from the manufacturing sequence and replaces it with simple top-side conductive layer formation and patterning. This simplification dramatically improves manufacturing yield and reduces production costs while achieving the same narrow frame or frameless display effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the process, reduces manufacturing difficulty, and prevents substrate issues, thereby improving yield and reducing production costs by eliminating the need for nano silver glue and physical vapor deposition equipment.
Implementation Method 1
performing a hot-pressing treatment on the metal film, so that the soldering aid layer is converted into a welding portion, and the metal film is electrically connected to the plurality of first wires through the welding portion
Implementation Method 2
the metal film is electrically connected to the plurality of first wires through the welding portion
Implementation Method 3
bending the metal film to a second surface of the back plate
Data Source
AI summary
Embodiments of the present application disclose a manufacturing method of a display panel and the display panel. By welding a metal film on a side of a back plate through a soldering aid layer, the soldering aid layer is converted into a welding portion, the metal film is electrically connected to a plurality of first wires through the welding portion; bending the metal film to a second surface of the back plate; and patterning the metal film and the welding portion to form a plurality of second wires, the second wires are disposed on the side and the second surface of the back plate, and the second wires are electrically connected to corresponding ones of the first wires.