Display Panel Groove Layout for Crack-Resistant Bending Wires

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Solution Overview

Problem

Flexible displays face issues with connection wires cracking due to stress concentration at bending areas, and the manufacturing process is hindered by the need for a separate anti-etching layer and mask process, leading to decreased productivity.

Innovation Solution

A display panel design that includes a substrate with grooves formed through etching, using a planarization layer as an anti-etching layer and a bending wire to protect connection wires, eliminating the need for a separate mask process and maintaining substrate rigidity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If connection wire is arranged on bending area to enable flexible display, then flexibility is improved, but stress concentration causes cracks in connection wire

Engineering Contradiction:
ImproveflexibilityVSAvoidconnection wire integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The connection wire structure is segmented into two parts: a bending wire arranged on the bending area that can flex without damage, and a connection wire arranged on the non-bending area that maintains structural integrity. The bending wire acts as an intermediate connector, allowing the display to flex while protecting the main connection wire from stress-induced cracks.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If separate anti-etching layer is arranged for etching process, then etching protection is improved, but manufacturing complexity increases due to additional mask process

Engineering Contradiction:
Improveetching process capabilityVSAvoidmanufacturing process steps
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The planarization layer is designed to serve dual functions: it provides surface planarization for the display structure and simultaneously acts as an anti-etching layer during the etching process. This multi-functionality eliminates the need for a separate anti-etching layer and its associated mask process, reducing manufacturing complexity while maintaining etching protection.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If etching process is applied to substrate for process optimization, then manufacturing efficiency is improved, but substrate rigidity may be compromised

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidsubstrate rigidity
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The etching process is applied locally to create grooves only in specific areas of the substrate where flexibility is needed, rather than uniformly etching the entire substrate. This localized etching approach maintains the overall rigidity of the substrate while enabling the desired flexibility in specific regions for display optimization.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design prevents connection wire damage, simplifies the manufacturing process, and improves productivity by optimizing the etching process, allowing for a narrower bezel in the display device.

Implementation Method 1

a substrate subjected to an etching process for the purpose of manufacturing process optimization

Methodology Applied
Scientific EffectEtching:

Data Source

PatentUS20260072319A1Display device and display panel
Publication Date: 2026.03.12 LG DISPLAY CO LTD
  • US20260072319A1 patent drawing
  • US20260072319A1 patent drawing
  • US20260072319A1 patent drawing

AI summary

A display device according to one or more examples may include a display panel including a groove and a circuit board connected to the display panel, and the display panel may include: a substrate including a first substrate and a second substrate spaced apart from each other by the groove; a circuit layer arranged on the first substrate and including a transistor; a planarization layer arranged on the first substrate and the groove; a pad portion arranged on the second substrate and connected to the circuit board; a bending wire arranged on the planarization layer; and a connection wire connected to the bending wire.