Display Panel Heat-Dissipation Layer for Thin-Bezel Cooling
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Solution Overview
Problem
Existing display apparatuses face challenges in improving heat-dissipation performance without increasing thickness, particularly in organic light-emitting displays, where additional heat-dissipation layers often enlarge the bezel area and compromise design and portability.
Innovation Solution
Incorporating a heat-dissipation layer with recesses or pores, such as a metal foam, and using additional rigid members to enhance heat dissipation without increasing the overall thickness, while maintaining aesthetic appeal and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat-dissipation layer is added to improve heat dissipation, then heat-dissipation performance is improved, but the thickness of the display apparatus increases
Solution Approach 1:
The patent embeds a heat-dissipation layer within an existing structure (such as within the bezel area or between existing layers), allowing heat dissipation functionality to be nested inside the existing thickness rather than adding to it externally
Solution Approach 2:
The patent employs porous or foam-like heat-dissipation materials that provide high surface area and thermal conductivity within a compressed volume, enabling effective heat dissipation without proportionally increasing thickness
2Temperature
If the thickness of the heat-dissipation layer is increased to effectively dissipate heat, then heat-dissipation efficiency is improved, but the overall thickness and bezel area increase
Solution Approach 1:
The patent applies heat-dissipation structures only in specific localized areas where heat generation occurs (such as near driver integrated circuits), rather than uniformly across the entire display apparatus, thereby improving heat dissipation efficiency without proportionally increasing overall bezel area
Solution Approach 2:
The patent transitions from increasing thickness in the vertical dimension to utilizing the horizontal bezel area more efficiently, or alternatively, uses high-density heat-dissipation materials that achieve the same thermal performance in a more compact dimensional footprint
3Adaptability or versatility
If additional components are disposed in the non-display area to improve functionality, then device functionality is improved, but the width and thickness of the display apparatus increase
Solution Approach 1:
The patent designs components (such as the bezel or structural layers) to serve multiple functions simultaneously - for example, providing structural support, housing additional functionality, and facilitating heat dissipation - thereby improving device functionality without requiring additional separate components that would increase thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation without enlarging the display apparatus' thickness or bezel area, maintaining design aesthetics and structural integrity, and enhancing portability.
Implementation Method 1
a heat-dissipation layer may be disposed on a rear surface of a display panel to emit or dissipate the heat from the driver integrated circuit
Implementation Method 2
a first heat-dissipation layer disposed at an upper portion of the first adhesive layer and formed of a metal having pores
Data Source
AI summary
A display apparatus includes a display panel configured to display an image from one surface of the display panel; a first rigid member disposed at another surface of the display panel; a first adhesive layer disposed at an upper portion of the first rigid member; and a first heat-dissipation layer disposed at an upper portion of the first adhesive layer, wherein the first heat dissipation layer has a first recess or a second recess having a step formed inwardly in one side or another side.