Display Panel Bezel Width Reduction via Reflective Metal Extraction
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Solution Overview
Problem
Existing display panels face challenges in minimizing the bezel width due to the need for a separation region between the encapsulation and driving circuit areas to protect thin-film-transistors from high temperatures during the frit packaging process, leading to wider bezels and reduced encapsulation reliability.
Innovation Solution
The display panel design incorporates a first metal layer with input signal lines in the frame encapsulation area, which also serves as a reflective metal layer, and a second metal layer extending through the separation area to the electronic circuit area, with an inorganic frame sealant bonding the array substrate and cover, allowing for reduced bezel width by optimizing the layout of electronic and frame encapsulation areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separation region is configured between the encapsulation region and the driving circuit region to prevent laser light from irradiating the driving circuits, then the thin-film-transistors are protected from high temperature degradation, but the left and right bezel regions become wider
Solution Approach 1:
The patent extracts the reflective metal layer function from the electronic circuit area and relocates it to the frame encapsulation area. This allows the driving circuits to be positioned closer to the encapsulation region without direct laser exposure, as the reflective layer is now separated into the bezel region where it cannot harm the circuits. This extraction resolves the contradiction by maintaining circuit protection while reducing overall bezel width.
Solution Approach 2:
The patent redistributes functional layers across different spatial zones: the reflective metal layer is moved from the electronic circuit area to the frame encapsulation area, creating a multi-zone layout. This dimensional reorganization allows the separation region to be minimized while still providing laser protection, as the reflective function is now in a different spatial dimension (the frame area) rather than overlapping with the circuit region.
2Reliability
If the left and right bezel regions are configured with encapsulation region, separation region, and driving circuit region, then the driving circuits are protected from laser irradiation, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the reflective metal layer with the frame encapsulation structure. Instead of having separate reflective layers in the circuit area and separate encapsulation regions, the reflective function is combined into the frame encapsulation area itself. This merging simplifies the overall structure by eliminating redundant layers and reducing the number of distinct regions needed in the bezel area.
Solution Approach 2:
The frame encapsulation area is given multiple functions: it serves as both the encapsulation region for sealing and as the location for the reflective metal layer. This multi-functionality reduces the need for separate dedicated regions, thereby simplifying the bezel structure while maintaining driving circuit protection from laser irradiation.
3Reliability
If a separate reflective metal layer is configured to reflect laser light away from the driving circuits, then the circuits are protected from high temperature, but the fabrication process requires additional steps
Solution Approach 1:
The reflective metal layer is formed in the frame encapsulation area during the preliminary stages of fabrication, before the driving circuits are fully assembled and sensitive to laser exposure. This preliminary placement ensures the reflective function is established early, protecting circuits in subsequent steps without requiring additional protective measures or process steps.
Solution Approach 2:
The frame encapsulation structure itself provides the reflective function through the metal layer formed in that area. The structure serves its own protective function without requiring separate dedicated reflective components or additional manufacturing steps. The encapsulation frame becomes self-sufficient by incorporating the reflective capability into its own structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the bezel width by approximately 400 μm to 550 μm, enhances encapsulation reliability, and simplifies the fabrication process by eliminating the need for a separate reflective metal layer, while maintaining the integrity of electronic circuit elements.
Implementation Method 1
The inorganic frame sealant bonds the array substrate and the cover together
Implementation Method 2
a first metal layer disposed in the frame encapsulation area... configured to supply input signals to the driving circuit unit... the inorganic frame sealant is disposed in the frame encapsulation area, and covers the first metal layer
Data Source
AI summary
A display panel, a display apparatus and a display panel fabrication method are provided. The display panel comprises an array substrate including a display area and a peripheral area surrounding the display area; a cover; and an inorganic frame sealant. The peripheral area includes a frame encapsulation area, a separation area, and an electronic circuit area, the electronic circuit area is disposed between the display area and the separation area, and the separation area is disposed between the frame encapsulation area and the electronic circuit area. The array substrate includes a first metal layer disposed in the frame encapsulation area and a driving circuit unit disposed at least partially in the electronic circuit area. The first metal layer includes first metal lines configured to supply input signals to the driving circuit unit. The inorganic frame sealant is disposed in the frame encapsulation area, and covers the first metal layer.