Display Panel Bonding with Segmented Conductive Adhesive
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Solution Overview
Problem
The existing display panel manufacturing processes face challenges in corrosion resistance, particularly in high-humidity and high-temperature environments, where the bonding area between the chip on film (COF) and the display panel is susceptible to corrosion, and the use of a back surface waterproof adhesive complicates the stripping of the glass substrate and affects subsequent processes.
Innovation Solution
A display panel and bonding method that include a conductive adhesive layer with conductive-particles doped regions and insulating rubber material regions, which form a sealed waterproof area without a back surface waterproof adhesive, ensuring corrosion resistance and facilitating the separation of the glass substrate from the OLED products without affecting subsequent processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a back surface waterproof adhesive is applied to protect signal lines from corrosion, then corrosion resistance is improved, but the glass substrate stripping operation becomes difficult and subsequent processes are affected
Solution Approach 1:
The bonding area is divided into a first area and a second area, with the conductive adhesive layer selectively positioned in the first area. This segmentation allows the waterproof adhesive to cover only the necessary bonding region without extending over the entire back surface, thus protecting signal lines while enabling proper glass substrate stripping and subsequent processing.
Solution Approach 2:
Instead of applying waterproof adhesive uniformly across the entire back surface, the invention applies the conductive adhesive layer locally only in the first area of the bonding region. This localized application provides corrosion protection precisely where needed (at the bonding interface) while leaving other areas accessible for stripping and subsequent operations.
2Reliability
If a back surface waterproof adhesive is applied to prevent corrosion, then signal line protection is improved, but the height of the adhesive exceeds the OLED layer after glass substrate stripping, affecting subsequent processes
Solution Approach 1:
The bonding area is segmented into a first area (where conductive adhesive is applied) and a second area (where no adhesive is applied). This segmentation ensures that the adhesive layer is confined to a specific region, preventing height excess problems while maintaining protection where the bonding interface requires it.
Solution Approach 2:
The conductive adhesive layer is applied with local quality - specifically in the first area of the bonding region - rather than uniformly across the entire back surface. This localized application strategy protects signal lines at the bonding interface while avoiding the creation of excessive height that would interfere with subsequent OLED processing steps.
3Ease of operation
If the back surface is left without waterproof adhesive to facilitate stripping, then ease of operation is improved, but corrosion resistance in the long term is compromised
Solution Approach 1:
The bonding area is divided into a first area (with conductive adhesive for protection) and a second area (without adhesive for accessibility). This segmentation enables both long-term corrosion resistance at the critical bonding interface and ease of operation for stripping and subsequent processes in other regions.
Solution Approach 2:
The conductive adhesive layer is applied with local quality - specifically in the first area where the bonding interface requires protection - rather than leaving the entire back surface exposed. This localized application provides long-term corrosion resistance where needed while maintaining ease of operation for stripping and subsequent processing in other areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the corrosion resistance of the display panel, improves product quality and stability by preventing signal line corrosion, and allows for easier glass substrate separation, eliminating the need for a back surface waterproof adhesive, thus maintaining the integrity of the OLED products in extreme environments.
Implementation Method 1
a conductive adhesive layer is formed in the bonding area; the conductive adhesive layer includes a conductive-particles doped region
Implementation Method 2
a first insulating rubber material region is formed between the conductive-particles doped region and the second area
Implementation Method 3
apply a layer of waterproof glue in the corrosive area to isolate air and moisture and achieve anti-corrosion requirements
Data Source
AI summary
The present disclosure provides a display panel and a bonding method of the display panel. Signal lines of a display area of the display panel extend to a bonding area of the non-display area. A conductive adhesive layer is formed in the bonding area. A waterproof adhesive layer is formed in the non-display area of the bonding area near the display area. The conductive adhesive layer includes a conductive-particles doped region and a first insulating rubber material region formed in the conductive-particles doped region near the display area.