Display Panel Bonding Layout for Narrow-Bezel Chip Stability
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Solution Overview
Problem
The uneven distribution of driving terminals on a driving chip causes warping and unbalanced binding, leading to shallow conduction and performance degradation in COG display panels.
Innovation Solution
The introduction of first dummy terminals in the first area of the driving chip, which are insulated and provide support, along with second dummy terminals in specific sub-areas, compensates for the warping and ensures proper binding by maintaining even distribution of forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If driving terminals are disposed only on one side of the driving chip to achieve narrow lower frame, then the frame width is reduced, but the driving terminals become unevenly distributed causing warping and binding failure
Solution Approach 1:
The driving chip is divided into two distinct areas: a first area adjacent to the display area containing dummy terminals, and a second area away from the display area containing driving terminals. This segmentation allows each area to serve its specific function while maintaining overall balance.
Solution Approach 2:
Different regions of the driving chip are assigned different terminal types based on local requirements. The first area receives dummy terminals for balance, while the second area receives functional driving terminals, creating local quality differentiation to solve the distribution uniformity problem.
2Length of stationary object
If driving terminals are concentrated on one side to reduce frame width, then the lower frame becomes narrower, but the driving chip experiences seesaw effect and terminal warping
Solution Approach 1:
Dummy terminals are introduced in the first area to act as counterweights that balance the weight and distribution of driving terminals in the second area. This counterbalancing prevents the seesaw effect and maintains driving chip flatness during binding.
Solution Approach 2:
The driving chip adopts an asymmetric terminal distribution pattern where dummy terminals and driving terminals are positioned differently in space. This asymmetric layout optimizes both the narrow frame width and the structural balance, preventing warping while achieving compact design.
3Area of stationary object
If driving terminals are unevenly distributed to achieve compact design, then the lower frame width is reduced, but conduction becomes shallow and binding fails
Solution Approach 1:
The terminal areas are segmented into first area with dummy terminals and second area with driving terminals. This segmentation ensures that functional driving terminals are properly positioned for reliable conduction while dummy terminals provide structural support, thereby maintaining binding reliability in the compact bonding area.
Solution Approach 2:
Local quality is optimized by placing driving terminals in the second area where they can achieve proper conduction depth and binding reliability, while dummy terminals in the first area provide structural balance. Each local region is optimized for its specific function within the compact bonding area.
Data Source
AI summary
The present disclosure provides a display panel and a display device. The display panel includes an array substrate. The array substrate includes a display area and a bonding area. The bonding area is positioned on a side of the display area, and a driving chip and a plurality of bonding pads are provided in the bonding area. The driving chip includes a first area adjacent to the display area and a second area far away from the display area. A plurality of first dummy terminals are provided in the first area, a plurality of driving terminals are provided in the second area, and the plurality of the driving terminals comprise a plurality of input terminals. The plurality of the input terminals have one-to-one correspondence with the plurality of the bonding pads.