Display Panel Bonding Pads Prevent Short-Circuit via Layer Stacking
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Solution Overview
Problem
In liquid crystal display panels, the small spacing between bonding pads and connecting lines can lead to short-circuiting issues due to poor manufacturing processes, resulting in abnormal driving signals and poor display quality.
Innovation Solution
The display panel circuit structure includes first bonding pads with a bottom, middle, and top pad stacked in metal and transparent conductive layers, with an insulating interlayer and passivation layer, ensuring that connecting lines are covered and preventing short-circuiting when a chip is pressed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the spacing between bonding pads and connecting lines is reduced to increase bonding density, then the area utilization is improved, but the risk of short-circuiting increases due to poor manufacturing process coverage
Solution Approach 1:
The patent moves the connecting lines from the second metal layer to the first metal layer, placing them in the same layer as the bonding pads. This dimensional repositioning allows the connecting lines to be covered by the insulating interlayer and passivation layer that are already present for bonding pad protection, thereby preventing short-circuiting while maintaining compact spacing and high area utilization.
2Ease of manufacture
If the passivation layer coverage is reduced to simplify the manufacturing process, then the ease of manufacture is improved, but the protection against short-circuiting deteriorates
Solution Approach 1:
The patent makes the insulating interlayer and passivation layer serve dual functions: they protect both the bonding pads and the connecting lines from short-circuiting. By positioning the connecting lines in the first metal layer alongside the bonding pads, the existing protective layers cover both structures, eliminating the need for additional protective layers or complex manufacturing steps while maintaining reliable short-circuit prevention.
Data Source
AI summary
In an embodiment, a display panel circuit structure includes: a display area and an output bonding area located on a side of the display area. The output bonding area includes: a plurality of first bonding pads arranged in parallel at intervals, and a plurality of first connecting lines between corresponding first bonding pads of the first bonding pads. Each of the first bonding pads includes: a first bottom pad, a first middle pad, and a first top pad. The first bottom pad and the first connecting lines are all located at a first metal layer, the first middle pad is located at a second metal layer, the first top pad is located at a transparent, electrically conductive layer, the first metal layer, the second metal layer, and the transparent, electrically conductive layer are stacked in order.