Display Panel Bonding Region Stability via Cover Plate Fixation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Liquid crystal display panels face reliability issues due to the bonding region on the array substrate swaying under external forces during rigorous mechanical tests, caused by gaps between the bonding region and the cover plate, and poor adhesion of the backlight module, leading to potential damage and display failures.
Innovation Solution
The display panel design includes a cover plate fixedly connected to the array substrate via an optically clear adhesive layer, ensuring the bonding region is securely supported, eliminating the need for fillers and improving adhesion with a glass cover plate, and using a Kapton tape for additional circuit support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the bonding region is left uncovered by the color film substrate to allow circuit bonding, then circuit integration is enabled, but the bonding region becomes vulnerable to external forces and sways under mechanical stress
Solution Approach 1:
The color film substrate is designed with a specific pattern that covers only certain areas of the array substrate, deliberately leaving the bonding region uncovered. This segmentation allows the bonding region to remain accessible for circuit attachment while the rest of the substrate provides structural support and color filtration functionality.
Solution Approach 2:
A fixation structure comprising a first fixation layer and a second fixation layer is introduced as an intermediary element between the array substrate and the bonding region. The first fixation layer is disposed on the array substrate and the second fixation layer is disposed on the bonding region, creating a stable connection that prevents swaying while maintaining circuit accessibility.
2Strength
If fillers are used to fill gaps between the bonding region and cover plate to improve adhesion, then mechanical strength is enhanced, but manufacturing complexity and material usage increase
Solution Approach 1:
The invention removes the filler material from the structure entirely. Instead of adding material to fill gaps between the bonding region and cover plate, the design relies on the fixation layers and direct structural support to maintain adhesion, thereby simplifying the manufacturing process and reducing material usage.
Solution Approach 2:
The fixation structure uses composite material layers (first fixation layer and second fixation layer) that provide both structural support and adhesive properties, replacing the need for separate filler materials and simplifying the overall construction.
3Ease of manufacture
If the cover plate is directly bonded to the array substrate without fixation layers to simplify manufacturing, then manufacturing steps are reduced, but the bonding region sways under external forces
Solution Approach 1:
The first fixation layer is disposed on the array substrate in advance, creating a prepared surface that facilitates subsequent bonding operations. This preliminary preparation ensures proper alignment and adhesion before the cover plate is attached, maintaining manufacturing efficiency while ensuring structural stability.
Solution Approach 2:
The fixation layers serve as intermediary bonding interfaces between the array substrate and cover plate, providing a controlled adhesion mechanism that prevents swaying while maintaining a relatively simple manufacturing process compared to direct bonding without preparation layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the mechanical reliability of the display panel by preventing swaying and breakage under external forces, reducing material usage and production costs, and simplifying the manufacturing process while maintaining high visual quality.
Implementation Method 1
a portion of a surface of the array substrate close to the cover plate corresponding to the bonding region is fixedly connected to the cover plate
Implementation Method 2
a Kapton tape for bonding the one of the at least one circuit to an end portion of the array substrate having the bonding region
Data Source
AI summary
A display panel includes a cover plate, an array substrate, and an opposite substrate. The array substrate is disposed between the cover plate and the opposite substrate. An edge of a surface of the array substrate away from the cover plate includes a bonding region for bonding at least one circuit, and a portion of a surface of the array substrate close to the cover plate corresponding to the bonding region is fixedly connected to the cover plate. The opposite substrate is assembled face to face with the array substrate.