Display Panel Bonding Support Structure for Narrow Bezel Reliability
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Solution Overview
Problem
In display panels, the regions outside the bonding of output pins and electrodes are prone to collapse, leading to uneven and shallow indentation, which affects the reliability and manufacturing yield due to the subsided arrangement of pins and electrodes, causing the middle position to tilt.
Innovation Solution
A supporting structure is introduced between the drive chip body and the base substrate, with orthographic projections of the supporting structure falling into regions outside the pin and bonding electrode areas, ensuring support and preventing collapse, and the pins and electrodes are arranged in a subsided manner to enlarge wiring space and reduce the frame size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the drive chip output pins are subsided to meet narrow frame requirements, then the frame size is reduced, but the regions outside the bonding area become unsupported and collapse
Solution Approach 1:
The supporting structure is divided into multiple segments (first supporting structure and second supporting structure) that are distributed at different positions between the drive chip and base substrate. This segmentation allows each supporting structure to independently provide localized support to different regions, preventing collapse while maintaining the subsided pin arrangement for narrow frame design.
Solution Approach 2:
The supporting structure acts as an intermediary element between the drive chip output pins and the base substrate bonding electrodes. It provides mechanical support to the regions outside the bonding area, preventing collapse and ensuring proper alignment during the bonding process, thereby enabling both narrow frame design and reliable bonding.
2Area of stationary object
If the output pins are arranged in a subsided manner to enlarge wiring space, then the wiring space is increased, but the middle position tilts up causing uneven indentation
Solution Approach 1:
The supporting structures are strategically positioned at specific locations (first and second positions between the drive chip and base substrate) to provide localized support where needed. This allows the output pins to be subsided for enlarged wiring space while the supporting structures compensate for the tilt at critical bonding regions, ensuring uniform indentation.
3Reliability
If the supporting structure is added to prevent collapse, then the reliability is improved, but the device complexity increases
Solution Approach 1:
Instead of providing continuous support across the entire drive chip, only partial support is provided at two specific positions (first and second supporting structures). This partial action is sufficient to prevent collapse and ensure bonding reliability without adding excessive structural complexity.
Data Source
AI summary
A display panel includes: a display substrate, including a display region and a peripheral region located outside the display region. The peripheral region includes a bonding region; the display substrate specifically includes a base substrate, a plurality of fanout lines located on one side of the base substrate in the peripheral region and extending to the bonding region, and a plurality of first bonding electrodes electrically connected with the fanout lines in one-to-one correspondence in the bonding region; a drive chip, including a drive chip body and a plurality of pins located on a side of the drive chip body facing the display substrate; wherein the plurality of pins include a plurality of output pins bonded with the first bonding electrodes in one-to-one correspondence.