Display Panel Bonding Structure With Through Holes
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Solution Overview
Problem
The existing bonding process between display panels and flexible printed circuits is inefficient due to high reflectivity of metal bonding structures, which reduces laser heating efficiency and leads to poor bonding uniformity, resulting in low bonding efficiency between the two components.
Innovation Solution
Incorporating through holes in the bonding structures of the display panel, allowing the laser to pass through and heat the bonding adhesive more effectively, with a specific arrangement of through holes to enhance heating uniformity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal bonding structures are used to bond display panels to flexible printed circuits, then electrical connection is achieved, but laser heating efficiency is reduced due to high reflectivity
Solution Approach 1:
The bonding structure is designed with through-holes penetrating through its thickness, creating a porous structure that allows laser beams to pass through and directly heat the bonding adhesive. This porous configuration reduces laser reflection while maintaining the electrical connection function, thereby improving laser heating efficiency without compromising bonding reliability
Solution Approach 2:
The bonding structure employs a composite design combining metal materials (for electrical conductivity) with through-holes (for laser transmission). This composite structure integrates the advantages of both metal bonding capability and laser permeability, resolving the contradiction between electrical connection reliability and laser heating efficiency
2Ease of manufacture
If traditional bonding structures are used, then manufacturing is simpler, but bonding uniformity is poor due to uneven laser heating
Solution Approach 1:
The bonding structure is segmented by introducing multiple through-holes that divide the metal bonding layer into separate regions. This segmentation allows laser energy to penetrate through the holes and uniformly heat the bonding adhesive across different areas, improving bonding uniformity while maintaining manufacturing feasibility through standardized hole patterning
Solution Approach 2:
The through-holes are strategically positioned and sized to create local variations in the bonding structure that optimize laser heating distribution. The local quality of the bonding structure is enhanced by allowing direct laser access to the adhesive in specific regions, ensuring uniform heating without complicating the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the heating efficiency and bonding uniformity between the display panel and the flexible printed circuit, enhancing the overall bonding process by allowing more laser penetration and consistent heating of the bonding adhesive.
Implementation Method 1
irradiating the display panel from a side of the display panel distal from the flexible printed circuit with a laser to enable the laser to pass through a through hole of the bonding structure to heat the bonding adhesive
Data Source
AI summary
The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.