Display Device Panel Segmentation for Higher Manufacturing Yield
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Solution Overview
Problem
Display devices face issues with low yield due to defects in circuit elements or light emitting elements, and the process is complicated by the need for an electromagnetic shield layer, leading to a more complex structure.
Innovation Solution
A display device is manufactured by separately forming a panel with light emitting elements and a panel with circuit elements, then bonding them, with a conductive layer connecting the elements, and using a simplified structure with a thicker conductive layer and insulating layer to improve yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electromagnetic shield layer is added to prevent interference between circuit elements and light emitting elements, then the reliability of the display device is improved, but the device complexity and manufacturing process become more complicated
Solution Approach 1:
The patent extracts the electromagnetic shield layer from the integrated structure and places it on a separate substrate. This allows the shield layer to be manufactured independently and then bonded to the substrate containing circuit elements and light emitting elements, reducing the complexity of the integrated manufacturing process while maintaining the reliability benefits of electromagnetic shielding.
Solution Approach 2:
The display device is divided into multiple substrates: a first substrate containing circuit elements and light emitting elements, and a second substrate containing the electromagnetic shield layer. These substrates are manufactured separately and then bonded together, allowing each component to be optimized independently while reducing overall manufacturing complexity.
2Ease of manufacture
If circuit elements and light emitting elements are formed together on the same substrate, then the manufacturing process is simplified, but the yield is reduced due to defects in either component type
Solution Approach 1:
The patent segments the manufacturing process by forming circuit elements and light emitting elements on separate substrates. Each substrate can be manufactured and tested independently, allowing defects to be identified and addressed in one component without affecting the other. The substrates are then bonded together to form the final display device, maintaining manufacturing simplicity while improving yield.
Solution Approach 2:
The patent performs preliminary manufacturing and testing of circuit elements on one substrate and light emitting elements on another substrate before final assembly. This allows each component to be fully formed and validated independently, ensuring that only defect-free components are combined in the final device, thereby improving overall yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for a simpler structure and improved yield in display device manufacturing by individually manufacturing panels and connecting them through a conductive layer, enhancing the reliability and efficiency of the process.
Implementation Method 1
an insulating film which is positioned between the common electrode and the liquid crystal layer and has a specific dielectric property
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
A display device includes a first substrate including a first area and a second area located at the edge of the first area. A first electrode and a second electrode are disposed on the first substrate, and are spaced apart from each other. Light emitting elements are disposed between the first electrode and the second electrode in the first area. A first conductive layer is disposed on the first electrode in the second area. A pixel circuit layer is disposed on the first conductive layer in the second area, and includes a transistor coupled to the first conductive layer. A second substrate is disposed on the pixel circuit layer.