Display Panel Bridge Contact Structure for Stable Vertical Connections

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Solution Overview

Problem

Existing display devices face challenges in enhancing integration and maintaining excellent electrical characteristics by improving the contact stability between vertically aligned conductive layers.

Innovation Solution

A display panel design featuring a bridge pattern and flat insulation layers that ensure stable connections between conductive patterns, with a connection electrode unit that includes a bridge bending unit and a flat conductive pattern, enhancing contact stability and electrical reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional contact structures are used between vertically aligned conductive layers, then the manufacturing process is simple, but the contact stability and electrical reliability are insufficient

Engineering Contradiction:
Improvecontact stabilityVSAvoidcontact structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The contact structure is divided into multiple functional segments: a lower conductive pattern, an upper conductive pattern, and a bridge pattern connecting them. This segmentation allows each component to be optimized independently for its specific function, improving overall contact stability while managing complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bridge pattern extends in multiple dimensions to connect vertically aligned conductive patterns, transitioning from simple vertical stacking to a three-dimensional configuration that enhances mechanical and electrical stability without significantly increasing manufacturing complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If vertically aligned conductive layers are used to increase integration, then device integration is enhanced, but contact stability between layers deteriorates

Engineering Contradiction:
Improveintegration degreeVSAvoidcontact stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The bridge pattern acts as an intermediary element between vertically aligned conductive patterns, providing a stable mechanical and electrical connection that enables high integration while maintaining contact reliability. This mediator structure resolves the conflict between vertical stacking for integration and contact stability

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If simple contact structures are used, then manufacturing is easier, but electrical characteristics are insufficient

Engineering Contradiction:
Improvecontact structure fabricationVSAvoidelectrical characteristics
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The contact structure parameters such as bridge pattern dimensions, material composition, and geometric configuration are optimized to achieve excellent electrical characteristics. These parameter adjustments improve electrical performance while remaining compatible with existing manufacturing processes

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20260026170A1Display panel, electronic device including the same, and display panel manufacturing method
Publication Date: 2026.01.22 SAMSUNG DISPLAY CO LTD
  • US20260026170A1 patent drawing
  • US20260026170A1 patent drawing
  • US20260026170A1 patent drawing

AI summary

A display panel and a method of manufacturing the display panel are disclosed. The display panel may include a base layer, a circuit layer, and a display layer, wherein the circuit layer includes a lower conductive pattern, a lower insulation layer having a contact opening to expose a top surface of the lower conductive pattern, a bridge pattern directly on the lower conductive pattern in the contact opening and arranged to extend to a top surface of the lower insulation layer, a flat insulation layer including a fill insulation part filling the contact opening and a flat insulation layer spaced from the fill insulation part and not overlapping the bridge pattern to be on the lower insulation layer, an upper conductive pattern arranged flat on the fill insulation part and the bridge pattern and electrically connected to the first electrode, and an upper insulation layer on the upper conductive pattern.