Display Panel Copper Etching With Plasma-Created Brim Removal Gap
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Solution Overview
Problem
In display panels with a three-layer copper structure, the etching selectivity between the barrier layer and copper leads to a brim formation at the interface, resulting in poor dielectric layer coverage and cracks during subsequent preparation.
Innovation Solution
A manufacturing method involving the formation of a first and second barrier layer with plasma treatment of the photoresist pattern to create a gap between the photoresist and the top barrier layer, allowing for effective removal of the brim during subsequent wet etching, thereby improving adhesive forces and preventing cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a three-layer copper structure with barrier layers is used to improve adhesive forces, then adhesive forces between copper film and dielectric layer are improved, but etching selectivity between barrier layer and copper causes brim formation at the interface
Solution Approach 1:
The patent applies a preliminary plasma treatment to the photoresist pattern before the second wet etching step. This plasma treatment pre-modifies the photoresist surface and creates conditions that prevent the brim formation during subsequent etching, thereby maintaining interface flatness while preserving the adhesive forces provided by the barrier layers
Solution Approach 2:
The patent changes the chemical and physical parameters of the photoresist through plasma treatment, altering its surface properties and etching characteristics. This parameter change enables the photoresist to better control the etching process, preventing brim formation at the barrier layer-copper interface while maintaining the necessary adhesive forces
2Productivity
If wet etching is performed on the three-layer structure, then the conductive layer pattern is formed, but the brim formation leads to poor dielectric layer coverage and cracks
Solution Approach 1:
The plasma treatment of the photoresist pattern serves as a preliminary action that prepares the photoresist for the subsequent wet etching process. This pre-treatment ensures that the photoresist maintains its structural integrity and provides proper protection during etching, preventing brim formation that would otherwise cause dielectric layer cracks
Solution Approach 2:
The plasma treatment process provides feedback control by modifying the photoresist properties based on the specific etching conditions. This creates a self-adjusting system where the photoresist adapts to the etching process, ensuring uniform etching without brim formation and maintaining dielectric layer integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the contact area between the etching solution and the brim, effectively removing it and preventing film disconnection, thus improving production yield and dielectric layer coverage.
Implementation Method 1
performing a plasma treatment on the photoresist pattern to form a first gap between the photoresist pattern and the second barrier layer
Data Source
AI summary
A manufacturing method of display panel, a display panel and a display device are disclosed. The manufacturing method includes following steps: providing a substrate, forming a first barrier layer on the substrate, forming a conductive layer on the first barrier layer, forming a second barrier layer on the conductive layer, forming a photoresist pattern on the second barrier layer, and then performing a plasma treatment on the photoresist pattern to form a first gap between the photoresist pattern and the second barrier layer.