Display Panel Layout for Under-Display Camera Transmissivity
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Solution Overview
Problem
Conventional display panels with integrated cameras face challenges in designing transistors with different characteristics, leading to increased manufacturing complexity and costs, and protruding bezels that degrade the visual appeal due to camera module configurations.
Innovation Solution
The display panel design includes a substrate with a camera area where insulating layers are removed to enhance optical transmissivity, allowing the camera to be integrated within the display area without increasing the bezel size, using a combination of thin film transistors with different semiconductor materials and a heat dissipation film with a hole corresponding to the camera area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If insulating layers are removed in the camera area to enhance optical transmissivity, then camera recognizability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent removes insulating layers (buffer layer, gate insulating layer, interlayer insulating layer) from the camera area to create an opening that exposes the substrate. This extraction of unnecessary insulating layers directly improves optical transmissivity in the camera region, allowing light to pass through more effectively for better camera recognizability.
Solution Approach 2:
The patent applies different structural configurations to different regions of the display panel. The camera area has insulating layers removed to maximize optical transmissivity, while other areas maintain the full insulating layer structure for proper electrical insulation and transistor functionality. This local differentiation optimizes each region for its specific function.
2Area of stationary object
If camera is integrated in display area, then bezel area is reduced, but manufacturing process becomes more complex
Solution Approach 1:
The patent integrates the camera module within the display area by removing insulating layers to create a shared structural region. This merging of camera and display functions in the same area eliminates the need for separate bezel regions, reducing overall bezel area while maintaining manufacturing feasibility through systematic layer removal.
Solution Approach 2:
The patent utilizes the vertical dimension by selectively removing insulating layers at specific depths in the camera area. This creates a multi-layered structure where the camera can be positioned in the display area without interfering with the overall panel structure, enabling integration while managing manufacturing complexity through controlled dimensional modification.
3Reliability
If thin film transistors with different semiconductor materials are used, then transistor characteristics are optimized, but manufacturing costs increase
Solution Approach 1:
The patent employs different semiconductor materials (oxide semiconductor and polysilicon) in different regions of the display panel. Oxide semiconductors are used in the display area where high mobility is needed for pixel control, while polysilicon is used in the gate driving area where different electrical characteristics are required. This local material differentiation optimizes transistor performance for each functional region.
Solution Approach 2:
The patent changes the semiconductor material parameter based on the functional requirements of different regions. By selecting oxide semiconductor for high-mobility applications in the display area and polysilicon for gate driving applications, the patent optimizes electrical characteristics such as carrier mobility and threshold voltage to match the specific performance needs of each transistor type.
Data Source
AI summary
The present disclosure provides a display apparatus, a display panel and a method for manufacturing the same. The display panel includes a substrate including a display area including a plurality of sub-pixels, and a gate driving area including a gate driving circuit, a first buffer layer contacting the substrate in the gate driving area, a second thin film transistor disposed in the gate driving area while including a second semiconductor layer made of a second semiconductor, a second buffer layer disposed at a first opening exposing the substrate in the display area while contacting the substrate, and a first thin film transistor disposed at the first opening in the display area while including a first semiconductor layer made of a first semiconductor different from the second semiconductor.