Display Panel Frame Width Reduction via Chamfered Bonding
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Solution Overview
Problem
Current display panel technologies face limitations in reducing frame width due to the need for reserved space for flexible circuit boards and driver chips, leading to increased thickness and broken signal lines.
Innovation Solution
A display panel design featuring a conductive film attached to the terminals of array and color filter substrates, with a chamfer on the bonding area edge, allowing the chip on film to be bonded smoothly and reducing the risk of broken lines, while maintaining reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the flexible circuit board is bonded to the side surface of the substrate to reduce the lower frame width, then the frame width is reduced, but the panel thickness increases due to the required sufficient length of the flexible circuit board
Solution Approach 1:
The patent transitions from bonding the flexible circuit board to the side surface (horizontal dimension) to bonding it to the conductive film on the terminal surface (vertical dimension via chamfer). This dimensional change allows the flexible circuit board to be positioned without increasing panel thickness, as it bonds to the chamfered edge rather than extending along the side surface.
Solution Approach 2:
The conductive film serves as an intermediary element between the flexible circuit board and the substrate. Instead of directly bonding the flexible circuit board to the substrate side surface, the conductive film on the chamfered edge provides a bonding interface that reduces frame width without requiring the flexible circuit board to extend along the side, thus avoiding thickness increase.
2Length of stationary object
If the flexible circuit board is bonded to the side surface of the substrate, then the frame width is reduced, but the signal lines may break due to insufficient bonding area
Solution Approach 1:
The chamfer is formed on the substrate edge before bonding the flexible circuit board. This preliminary action creates a smooth transition surface that prevents signal line breakage during bonding, eliminating the need for the flexible circuit board to have excessive length while ensuring reliable electrical connection.
Solution Approach 2:
The patent changes the bonding interface parameters by creating a chamfered edge with specific geometric characteristics. This parameter change (from a sharp edge to a chamfered surface) provides a smooth transition that prevents signal line breakage while maintaining adequate bonding area, thus ensuring signal line integrity without increasing frame width.
3Area of stationary object
If space is reserved on the array substrate for bonding the driver chip and flexible circuit board, then the lower frame area is increased, but the screen ratio is reduced
Solution Approach 1:
The patent extracts the bonding function from the lower frame area and relocates it to the side terminal surface. By bonding the flexible circuit board to the conductive film on the chamfered edge rather than reserving space in the lower frame, the lower frame area is minimized while maintaining adequate bonding area, thus maximizing screen ratio.
Solution Approach 2:
The bonding operation is moved from the horizontal plane (lower frame area) to the vertical dimension (side terminal surface with chamfer). This dimensional relocation allows the flexible circuit board to be bonded without occupying lower frame space, thereby reducing lower frame area and increasing screen ratio.
Data Source
AI summary
The present disclosure provides a display panel, a manufacturing method thereof, and a display device. By disposing a conductive film at terminals of an array substrate and a color filter substrate having sides flush with each other, forming a chamfer on an edge of a bonding area corresponding to the color filter substrate or the array substrate, and making a chip on film bonded to the conductive film and bent along the chamfer for bonding, frame widths of display panels and risks of broken lines in a frame area of display panels are reduced.