Display Panel Bonding Layout to Prevent Chip Seesaw Warping
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Solution Overview
Problem
Traditional display panels experience a 'seesaw' effect when the driving chip is bound, causing some driving terminals to warp and fail to connect properly with the display panel, leading to performance degradation or failure.
Innovation Solution
The display panel design includes a driving chip with first and second dummy terminals and an insulation protective layer, which compensates for height differences and prevents metal wiring damage, ensuring proper binding and conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If driving terminals are disposed only on one side of the driving chip to achieve narrow lower frame, then the display panel frame size is reduced, but the driving terminals become unevenly distributed causing seesaw effect and warping
Solution Approach 1:
The patent applies asymmetry by intentionally creating an uneven distribution of dummy terminals on one side of the driving chip to counterbalance the asymmetric placement of driving terminals on the other side. This asymmetric compensation structure offsets the seesaw effect caused by the narrow frame design, achieving both narrow lower frame and driving chip stability.
2Device complexity
If driving terminals are concentrated on one side for narrow frame design, then manufacturing complexity is reduced, but binding reliability deteriorates due to warping and shallow conduction
Solution Approach 1:
The patent applies preliminary action by pre-configuring dummy terminals and insulation protective layers on the driving chip before binding to the display panel. These preliminary structural arrangements compensate for potential warping and ensure proper contact between driving terminals and bonding pads, thereby guaranteeing binding reliability before the actual binding process occurs.
Solution Approach 2:
The patent applies beforehand cushioning by introducing dummy terminals and insulation protective layers that act as compensatory structures. These structures provide mechanical cushioning and stress distribution before binding, preventing warping and ensuring reliable electrical conduction between the driving chip and display panel.
3Area of stationary object
If driving terminals are placed asymmetrically for narrow frame, then area utilization is improved, but manufacturing precision is compromised due to warping effects
Solution Approach 1:
The patent applies local quality by creating different structural characteristics in different regions of the driving chip. The dummy terminals and insulation protective layers are locally positioned in specific areas to provide targeted compensation for warping, ensuring that each region of the driving chip has the appropriate structural properties for maintaining alignment precision during binding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents warping of driving terminals, ensuring reliable connection and preventing damage to metal wirings, thereby maintaining the display panel's performance and preventing shallow conduction.
Implementation Method 1
a conducting resin is provided between the driving chip and the array substrate, and a plurality of conducting particles are distributed in the conducting resin
Data Source
AI summary
The present disclosure provides a display panel and a display device. The display panel includes an array substrate, a bonding area of the array substrate is provided with a plurality of bonding pads and a driving chip. A first area of the driving chip is at least provided with a plurality of first dummy terminals. A height difference caused by warping of driving terminals can be compensated by the first dummy terminals, thereby avoiding a phenomenon of shallow conduction. An insulation protective layer is provided on a part of the array substrate which is corresponding to the first dummy terminals, thereby preventing metal wirings from extrusion damage.