Display Panel COF Connection via Conductive Filled Holes
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Solution Overview
Problem
The challenge is to produce a display product with a narrow bezel without the connection terminal bending process, which often results in cracked inorganic insulation layers and increased manufacturing complexity and cost.
Innovation Solution
A display panel design featuring a COF film attached to the display substrate with an adhesive, signal lines, insulation layer, and conductive material-filled connection holes that connect to terminals on the COF film, eliminating the need for connection terminal bending and enhancing contact area and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If connection terminal bending process is used to achieve narrow bezel, then bezel width is reduced, but inorganic insulation layer cracks and manufacturing complexity increases
Solution Approach 1:
The connection structure is segmented into multiple components: connection holes penetrating the substrate, conductive material filling these holes, signal lines on the substrate, and connection terminals on the COF film. This segmentation eliminates the need for bending the entire connection terminal while achieving narrow bezel, as each component can be independently positioned and connected without mechanical stress concentration.
Solution Approach 2:
Conductive material serves as an intermediary element between the signal lines on the substrate and the connection terminals on the COF film. This intermediary connection method allows electrical connection without direct mechanical coupling that would require bending, thus preventing insulation layer cracks while achieving the narrow bezel design.
2Length of moving object
If connection terminal bending process is used, then narrow bezel is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
Connection holes are formed and conductive material is filled into them before the COF film is attached to the substrate. This preliminary preparation of connection structures eliminates the need for subsequent bending operations, simplifying the manufacturing process while achieving narrow bezel. The signal lines and connection terminals are pre-positioned and connected through the conductive material in the holes.
Solution Approach 2:
The bending operation is extracted and removed from the manufacturing process entirely. Instead of bending connection terminals to achieve connection, the patent uses a through-hole connection method where conductive material is filled into holes that penetrate the substrate, directly connecting signal lines to connection terminals without any bending step.
3Ease of manufacture
If conventional connection method is used, then manufacturing process is simpler, but contact reliability between conductive material and signal lines is poor
Solution Approach 1:
The connection holes are designed with specific local characteristics: they penetrate through the substrate at precise locations where signal lines are present, and their dimensions are controlled to ensure proper filling with conductive material. This local optimization of hole position, size, and distribution ensures reliable contact between the conductive material and signal lines while maintaining overall manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a narrower bezel without the bending process, increases product yield by ensuring proper contact between conductive material and signal lines, and simplifies manufacturing by reducing the number of required mask processes.
Implementation Method 1
a conductive material, filled in the connection holes, wherein the signal lines are connected to connection terminals disposed on the COF film by the conductive material
Implementation Method 2
an adhesive disposed between the display substrate and the COF film, the COF film being fixed on the side of the display substrate opposite to the display surface by the adhesive
Data Source
AI summary
A display panel, a manufacturing method thereof, and a display device are provided. The display panel includes: a display substrate, a COF film disposed on a side of the display substrate; a plurality of signal lines disposed on another side of the display substrate, an insulation layer located between the signal lines and the display substrate, a plurality of connection holes penetrating at least the display substrate, the signal lines and the insulation layer and a conductive material filled in the connection holes. The signal lines are connected to connection terminals disposed on the COF film by the conductive material; the insulation layer has recesses each of which surrounds the respective connection holes.