Display Panel Layout for In-Display Component Integration
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Solution Overview
Problem
As display apparatuses increase in size and resolution, integrating additional components within the display area poses challenges in terms of structural integrity and functional compatibility without compromising display performance.
Innovation Solution
A display panel design that includes a substrate with distinct areas for components and display elements, featuring a multi-layered film structure with contact points and grooves to facilitate electrical connections while allowing space for additional components, such as sensors or speakers, within the display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the size of the display area is increased to accommodate various functions and components, then the functionality and component integration are improved, but the risk of moisture penetration and reliability degradation increases
Solution Approach 1:
The encapsulation structure is divided into multiple separate encapsulation layers (first encapsulation layer and second encapsulation layer) that are positioned at different locations. These segmented layers work together to provide comprehensive moisture protection across the enlarged display area, addressing the reliability challenge while maintaining design flexibility for component integration.
Solution Approach 2:
The patent transitions from a single-layer encapsulation approach to a multi-layer encapsulation architecture distributed across different spatial dimensions and locations. This dimensional expansion of the encapsulation structure enables effective moisture barrier performance across the larger display area while accommodating various components and functions.
2Adaptability or versatility
If various components are arranged within the display area to add functions, then the functionality is improved, but the manufacturing complexity and precision requirements increase
Solution Approach 1:
The display area is divided into multiple sub-regions with specific components arranged in designated locations. The encapsulation layers are also segmented and positioned to cover specific component areas, allowing for modular manufacturing processes that reduce precision requirements compared to a fully integrated single-layer approach.
Solution Approach 2:
Different encapsulation layers are applied to different locations within the display area based on specific protection needs. This localized encapsulation approach allows manufacturing processes to focus on specific areas with appropriate precision levels, reducing overall manufacturing complexity while maintaining functionality.
3Reliability
If a multi-layer encapsulation structure is used to prevent moisture penetration, then the moisture barrier effectiveness is improved, but the device complexity increases
Solution Approach 1:
The encapsulation system is segmented into multiple layers positioned at different locations rather than using a single complex continuous layer. This segmentation simplifies the manufacturing process for each individual layer while achieving superior overall moisture protection through the combined effect of multiple simpler layers.
Solution Approach 2:
The patent adds a layer dimension to the encapsulation structure by stacking multiple encapsulation layers at different positions. This dimensional approach to moisture protection provides enhanced barrier effectiveness while keeping each individual layer relatively simple in structure, thereby managing overall device complexity.
Data Source
AI summary
A display panel includes: a substrate including a first area, a second area, and a third area located between the first area and the second area; a display layer including a display element located in the second area; a first metal layer located in the third area; an organic insulating layer located on the first metal layer and including at least one contact portion; and a second metal layer located on the organic insulating layer and contacting the first metal layer through the at least one contact portion, in which the second metal layer has a first hole, and the organic insulating layer has a second hole or a first recess corresponding to the first hole, and a residual layer located in the second hole or the first recess and including a part of at least one organic layer overlaps the first metal layer.