Display Panel Conductive Structure Layer Bending for Narrow Frame
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Solution Overview
Problem
In display panels, the edge alignment of array and color filter substrates is hindered by the need for bare metal wires on the external circuit board side, leading to wider frames on this side, as opposed to the other sides, due to the use of Chip On Film (COF) or Chip On Glass (COG) technologies.
Innovation Solution
A conductive structure layer with a bonding area is formed on a substrate, with parts of this area protruding and bent away from the substrate, and attached to a protective strip, allowing for a narrower frame by relocating the bonding area away from the substrate edge and securing it with a protective strip and adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bare metal wires are provided on the array substrate for electrical connection with the external circuit board, then electrical connectivity is achieved, but the frame width on the external circuit board side must be wider
Solution Approach 1:
The bonding area of the conductive structure layer is bent from the plane of the array substrate toward the color filter substrate side, transitioning from a 2D layout to a 3D configuration. This allows the bonding area to be positioned closer to the edge of the array substrate while maintaining electrical connectivity, thereby reducing the frame width on the external circuit board side without compromising electrical connection reliability
2Length of stationary object
If the bonding area is bent toward the color filter substrate side, then the frame width is reduced, but the conductive structure layer may be damaged
Solution Approach 1:
A protective strip is disposed on the array substrate at the location where the bonding area will be bent, before the bending process. This protective strip serves as a cushioning layer that supports the conductive structure layer during bending, distributing the stress and preventing damage to the conductive structure layer while enabling the frame width reduction
3Strength
If the bonding area is bent and attached to the protective strip, then the conductive structure layer is protected from damage, but the manufacturing process becomes more complex
Solution Approach 1:
The protective strip is disposed on the array substrate before the bonding area is bent and attached. This preliminary placement of the protective strip simplifies the subsequent bending and attachment processes, as the protective strip is already in position to guide and support the bonding area during these operations, rather than requiring complex positioning and alignment steps
Data Source
AI summary
A display panel includes a first substrate on which a conductive structure layer is formed. The conductive structure layer has a bonding area close to a side edge thereof, at least a part of the bonding area of the conductive structure layer protrudes from a first side edge of the first substrate, and is bent toward a side of the first substrate away from the conductive structure layer and fixed; an end surface of the first side edge of the first substrate is provided with a first protective strip, the first protective strip has a first smooth surface facing the conductive structure layer and smoothly connected with a side surface of the first substrate on which the conductive structure layer is formed, and a bent part of the conductive structure layer is attached to the first smooth surface.