Display Panel Conductive Structure for Narrow Bezel Design
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Solution Overview
Problem
Existing display panel technologies face challenges in achieving narrow bezels on both sides due to the edge alignment of array and color film substrates, particularly on the external circuit board side where bare metal wires require electrical connection, limiting the narrowness of bezels on the external circuit board side.
Innovation Solution
A conductive structure layer is formed on the side surface of a substrate with a bonding region that protrudes and is bent away from the substrate, allowing the bonding region to be relocated from the substrate to a backplate assembly, thereby narrowing the bezel on the external circuit board side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the array substrate is provided with bare metal wires (bonding region) for electrical connection with the external circuit board, then the electrical connection function is achieved, but the bezel width on the external circuit board side becomes wide
Solution Approach 1:
The bonding region is extracted from the array substrate and relocated to an independent flexible circuit board. This separation allows the array substrate to achieve edge alignment with the color film substrate for narrow bezel, while the bonding region maintains electrical connection functionality on the flexible circuit board that can be routed to the external circuit board.
Solution Approach 2:
The display panel structure is segmented into distinct functional modules: the array substrate for display pixel control, the flexible circuit board for electrical connection, and the color film substrate for color filtering. This segmentation allows each component to be optimized independently, enabling narrow bezel while maintaining reliable electrical connections.
2Length of stationary object
If edge alignment of the array substrate with the color film substrate is achieved on the non-external circuit board sides, then the bezel width on those sides becomes narrow, but the bezel width on the external circuit board side remains wide due to the bonding region
Solution Approach 1:
The bonding region is relocated from the planar two-dimensional arrangement on the array substrate to a three-dimensional flexible circuit board structure that can extend in multiple directions. This dimensional change allows the electrical connection path to be routed away from the display edge, enabling narrow bezel while maintaining connection functionality.
Data Source
AI summary
A display panel, a display device and a preparation method for a display panel. The display panel includes a first substrate; a conductive structure layer is formed on a side surface of the first substrate, and the conductive structure layer is provided with a binding region close to a side edge thereof; the binding region of the conductive structure layer protrudes from a first end surface of the first substrate, and a protruding part of the conductive structure layer forms a first protruding portion; the first protruding portion bends toward a side of the first substrate away from the conductive structure layer; and a turning portion of the first protruding portion is fixed on the first end surface of the first substrate. The binding region of the conductive structure layer is located at a bending part of the conductive structure layer and is not carried on the first substrate.