Display Panel Connecting Structure Moisture Protection

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Solution Overview

Problem

The integration of driving circuits in display panels makes them susceptible to moisture erosion, leading to reliability issues and reduced operational life.

Innovation Solution

A display panel design that includes a first substrate with a connecting structure, a passivation layer, and a sealant, where the connecting structure electrically connects metal layers and is covered by the passivation layer to prevent moisture ingress, and the sealant is positioned between substrates to further protect the circuitry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If driving circuit elements are integrated in the display panel, then the size and performance of the display device are minimized and improved, but the elements are susceptible to moisture erosion, resulting in reliability issues and reduced operation life

Engineering Contradiction:
ImproveperformanceVSAvoidreliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces a sealant as an intermediary substance between the first substrate and second substrate, and a passivation layer as a protective intermediary over the connecting structure. These intermediary elements create a barrier that prevents moisture from reaching the integrated driving circuit elements, thus resolving the contradiction between integration benefits and moisture susceptibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs thin film structures including the passivation layer formed over the connecting structure and the sealant layer between substrates. These thin film barriers effectively block moisture penetration while maintaining the compact integrated design, addressing the reliability concern without sacrificing the performance benefits of circuit integration.

Inventive Principle:
Principle #30Flexible shells and thin films

2Volume of moving object

If driving circuit elements are integrated in the display panel, then the size of the display device is minimized, but the elements are exposed to external moisture, causing erosion and reduced operation life

Engineering Contradiction:
ImprovesizeVSAvoidmoisture erosion
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent uses thin film barriers including the passivation layer covering the connecting structure and the sealant between substrates to protect the integrated circuit elements from moisture. These films maintain the compact size while providing effective moisture protection.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The sealant creates a sealed environment between the first and second substrates, effectively isolating the integrated driving circuit elements from the external environment. This sealed inert environment prevents moisture ingress while maintaining the minimized device size.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

Data Source

PatentUS10254612B2Display panel and method of fabricating the same
Publication Date: 2019.04.09 HANNSTAR DISPLAY NANJING
  • US10254612B2 patent drawing
  • US10254612B2 patent drawing
  • US10254612B2 patent drawing

AI summary

A display panel is provided, and includes a first substrate, a connecting structure, a passivation layer, a second substrate and a sealant. The first substrate has an active area and a peripheral area. The connecting structure is disposed on the first substrate and located in the peripheral area, and is configured to electrically connect different metal layers. The passivation layer is disposed on and covers the connecting structure. The second substrate is disposed opposite to the first substrate. The sealant is sandwiched between the first substrate and the second substrate. In the display panel, a vertical projection of the sealant on the first substrate and a vertical projection of the connecting structure on the first substrate are overlapped.