Active-Matrix Display Panel Contact Hole Oxide Prevention
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Solution Overview
Problem
Conventional methods for manufacturing active-matrix display panels often result in connection failures between the TFT layer's upper electrode and the anode due to the formation of a metal oxide film at the contact holes, leading to deteriorated display quality.
Innovation Solution
A method involving the formation of contact holes in both the passivation and planarizing layers using a gas containing fluorine, followed by the deposition of a fluorine-containing liquid-repellent film on the inner walls of these layers to prevent moisture ingress and oxide film formation, ensuring a reliable connection between the TFT layer's electrode and the display element unit's electrode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact holes are formed in the passivation layer and planarizing layer using conventional dry-etching methods, then the manufacturing process can be completed, but metal oxide films form at the contact holes causing connection failures
Solution Approach 1:
The patent applies preliminary anti-action by forming a fluorine-containing liquid-repellent film on the inner walls of the passivation layer and planarizing layer before forming the contact holes. This liquid-repellent film creates a barrier that prevents moisture from reaching the electrode surfaces during the subsequent contact hole formation process, thereby preventing oxide film formation before it can occur. The fluorine-containing film is deposited in advance to counteract the harmful oxidation effect that would otherwise occur during manufacturing.
Solution Approach 2:
The patent creates an inert environment by using a fluorine-containing liquid-repellent film that repels moisture and prevents water molecules from contacting the electrode surfaces. This film establishes a protective atmosphere within the contact hole regions, isolating the electrodes from oxidizing conditions during the manufacturing process, similar to how inert gas atmospheres protect materials from oxidation in other industrial processes.
2Productivity
If conventional manufacturing methods are used to form contact holes, then the process is simple and fast, but connection failures occur due to oxide film formation
Solution Approach 1:
The patent implements preliminary action by depositing the fluorine-containing liquid-repellent film on the inner walls of the passivation layer and planarizing layer before forming the contact holes. This preparatory step ensures that when contact holes are subsequently formed, the electrode surfaces are already protected from moisture ingress, preventing oxide film formation without requiring additional corrective steps later in the manufacturing process.
3Device complexity
If no protective film is formed on the inner walls, then the manufacturing process is shorter, but moisture enters the contact holes causing oxide film formation
Solution Approach 1:
The fluorine-containing liquid-repellent film creates a moisture-repelling environment within the contact hole structures, effectively establishing an inert barrier that prevents water molecules from contacting and oxidizing the electrode surfaces. This protective atmosphere is maintained throughout the subsequent manufacturing steps, ensuring electrode integrity without requiring complex additional protective measures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents the formation of oxide films on the electrodes, ensuring an excellent connection and improved display quality by maintaining the integrity of the contact holes and reducing moisture-induced oxidation.
Implementation Method 1
forming contact holes in both the passivation and planarizing layers using a gas containing fluorine, followed by the deposition of a fluorine-containing liquid-repellent film on the inner walls of these layers
Data Source
AI summary
Manufacturing method including forming, over substrate, TFT layer, planarization layer, and display element in this order. Forming of TFT layer involves forming passivation layer to cover TFT layer electrode, such as upper electrode, and to come in contact with planarizing layer. Forming of display element involves forming bottom electrode to come in contact with planarizing layer. TFT layer electrode and bottom electrode are connected by: first forming, in planarizing layer, first contact hole exposing passivation layer at bottom thereof; then forming second contact hole exposing TFT layer electrode at bottom thereof through dry-etching passivation layer exposed at bottom of first contact hole using fluorine-containing gas; then forming liquid repellent film containing fluorine on passivation layer inner surface facing second contact hole; and forming bottom electrode along planarizing layer inner surface and passivation layer inner surface respectively facing first contact hole and second contact hole.