Display Panel Crack Blocking Structure for Mask Precision
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Solution Overview
Problem
Conventional display panel manufacturing processes require precise positional accuracy and frequent mask replacement, leading to increased complexity and production costs due to the short service life of masks and occlusion issues during the cutting process.
Innovation Solution
A display panel design featuring a crack blocking structure with a cutting portion and concave portion on the first flexible layer, where the first and second inorganic layers are disconnected at the opening of the concave portion, preventing crack extension and reducing the need for extensive mask occlusion, thereby simplifying the manufacturing process and extending mask service life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional mask structure is used during manufacturing, then the inorganic layers can be formed, but the mask requires strict positional accuracy control and frequent replacement due to short service life, increasing manufacturing complexity and cost
Solution Approach 1:
The inorganic encapsulation structure is segmented into multiple discrete inorganic layers (first inorganic layer, second inorganic layer, third inorganic layer) with organic encapsulation layers in between. This segmentation allows each layer to be formed independently with relaxed mask requirements, as cracks in one layer do not propagate to adjacent layers. The mask only needs to cover the binding portion rather than the entire display panel area, reducing positional accuracy requirements and extending mask service life.
Solution Approach 2:
The encapsulation structure transitions from a planar 2D mask coverage to a 3D multi-layer architecture with vertical stacking of inorganic and organic layers. This dimensional change allows the mask to be removed after forming the binding portion, as the subsequent inorganic layers are deposited through different mechanisms that do not require mask occlusion of the entire panel area.
2Reliability
If the mask occludes the entire display panel area, then complete coverage is achieved, but the mask service life is short and replacement frequency increases
Solution Approach 1:
The mask function is extracted from covering the entire display panel area and concentrated only on the binding portion where the inorganic layers meet. The mask is removed after forming the binding portion, and subsequent inorganic layers are deposited without mask coverage. This extraction of the mask's functional requirement to only the binding area extends mask service life and reduces replacement frequency while maintaining encapsulation reliability.
3Reliability
If the inorganic layers are continuous across the display panel, then encapsulation is complete, but cracks can extend across the entire panel causing package failure
Solution Approach 1:
The continuous inorganic encapsulation layer is segmented into multiple discrete inorganic layers (first, second, and third inorganic layers) separated by organic encapsulation layers. This segmentation prevents crack propagation across the entire panel, as cracks in one inorganic layer are contained and do not extend to adjacent inorganic layers. The multi-layer structure maintains encapsulation integrity while providing crack isolation.
Solution Approach 2:
The organic encapsulation layers are positioned between the inorganic layers to provide beforehand cushioning against crack propagation. When cracks occur in an inorganic layer, the organic layers absorb and contain the stress, preventing crack extension to adjacent inorganic layers and the substrate, thereby protecting the overall package integrity.
4Manufacturing precision
If the mask is used for the entire manufacturing process, then complete coverage is ensured, but production cost increases due to frequent mask replacement
Solution Approach 1:
The mask's functional requirement is extracted from covering the entire display panel and limited only to the binding portion where inorganic layers meet. The mask is removed after forming the binding portion, eliminating the need for continuous mask usage throughout the entire manufacturing process. This reduces mask replacement frequency and associated production costs while maintaining coverage accuracy where required.
Solution Approach 2:
The manufacturing process transitions from 2D planar mask coverage to 3D multi-layer deposition where subsequent inorganic layers are deposited through techniques that do not require mask occlusion. This dimensional change allows the mask to be used only for the binding portion formation, reducing mask consumption and production costs.
Data Source
AI summary
A display panel, a mask, and a display device are provided. The display panel includes a substrate, a first flexible layer, a first inorganic layer, and a second inorganic layer stacked from bottom to top. A crack blocking structure is disposed on the first flexible layer, and the crack blocking structure includes a cutting portion and a concave portion located at two sides of the cutting portion. The first inorganic layer and the second inorganic layer are disconnected at an opening of the concave portion. The concave portion is configured to block cracks of the first inorganic layer and the second inorganic layer from extending to two sides of the crack blocking structure when the cutting portion cuts the display panel.