Display Panel Insulating Layer for Flat Surface and Crack Prevention
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Solution Overview
Problem
Oxidation occurs between the organic light-emitting layer and electrodes in electroluminescent displays due to infiltration of oxygen and moisture, leading to issues like pores or cracks caused by thermal expansion coefficient differences between the planarization layer and the pixel driver, resulting in poor adhesion and potential separation during processing.
Innovation Solution
Incorporating an insulating layer between the pixel driver and planarization layer to prevent infiltration, with openings in the upper insulating layer allowing electrical connections, and using multiple conductive lines across stacked insulating layers to route signals while maintaining a flat surface, along with alignment markers and layered buffer materials for accurate component transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the pixel driver is disposed under and buried by the planarization layer, then the display panel can achieve a flat surface and proper structure, but pores or cracks are generated due to difference in thermal expansion coefficients and low adhesion between the planarization layer and the pixel driver
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the planarization layer and the pixel driver. This adhesive layer specifically addresses the adhesion problem by providing strong bonding between the two components, preventing pore formation and crack generation while maintaining the flat surface structure achieved by burying the pixel driver under the planarization layer.
2Stability of the object's composition
If the pixel driver is disposed under and buried by the planarization layer, then the display panel can achieve proper structure, but oxidation occurs between the organic light-emitting layer and the electrodes due to infiltration of oxygen and moisture
Solution Approach 1:
An organic protective layer is introduced as a thin film barrier between the pixel driver and the external environment. This protective layer specifically addresses the oxidation problem by preventing oxygen and moisture from infiltrating to the organic light-emitting layer and electrodes, while maintaining the structural stability achieved by the buried pixel driver configuration.
3Ease of manufacture
If multiple layers of conductive lines are formed across stacked insulating layers, then signals and power can be routed while keeping the surface even, but the device complexity increases
Solution Approach 1:
The conductive lines are distributed across multiple stacked insulating layers, utilizing the vertical dimension to route signals and power. This multi-layer approach maintains an even surface by hiding the complexity in the vertical dimension rather than creating surface irregularities, achieving proper signal routing while keeping the top surface flat and even.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and manufacturing yield of organic light-emitting displays by preventing cracks and pores, ensuring stable performance and accurate alignment, allowing for adjustable brightness even if one light-emitting element fails.
Implementation Method 1
an insulating layer between the pixel driver and the planarization layer to prevent infiltration
Implementation Method 2
pores or cracks may be generated by a difference in thermal expansion coefficients of the planarization layer and the pixel driver during a subsequent process due to low adhesion
Data Source
AI summary
Disclosed herein is a display panel including a pixel driver in a display area and an insulating layer disposed under and covered by a planarization layer. The insulating layer includes an upper insulating layer having one or more openings that expose a plurality of pads of the pixel driver, allowing electrical connection to external lines. By positioning the insulating layer between the planarization layer and the pixel driver, the structure reduces the likelihood of pore formation caused by adhesion failure or thermal stress, thereby enhancing reliability and manufacturing yield.


