Display Panel Crack Testing Circuit With EMI-Resistant Modes
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Solution Overview
Problem
Existing technologies face challenges in evaluating structural defects or cracks in semiconductor devices with precision while being resistant to electromagnetic interference (EMI).
Innovation Solution
A testing circuit and method that utilizes a conductive ring structure with multiple testing modes, including a first mode for high precision and a second mode with better EMI immunity, using switch circuits and signal generators to generate and receive test signals for precise resistance measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single testing mode is used, then the device complexity is reduced, but the adaptability to different electromagnetic conditions and precision requirements deteriorates
Solution Approach 1:
The testing circuit is designed with multiple testing modes (first testing mode and second testing mode) that can be switched between based on different electromagnetic conditions and precision requirements. The same circuit structure serves multiple functions by configuring different signal generators and receivers to perform different measurement tasks, thereby achieving adaptability without proportionally increasing device complexity
Solution Approach 2:
The testing circuit incorporates switchable configurations where different test signal generators (first test signal generator, second test signal generator) and receivers can be dynamically connected or disconnected based on the selected testing mode. This dynamic reconfiguration allows the circuit to adapt to different electromagnetic environments and measurement requirements while maintaining a relatively simple base structure
2Measurement precision
If high precision testing is performed, then the measurement precision is improved, but the susceptibility to electromagnetic interference deteriorates
Solution Approach 1:
The patent acknowledges that high precision testing makes the system more vulnerable to EMI, but converts this vulnerability into a feature by providing a second testing mode specifically designed for EMI-prone environments. This mode uses different signal generation and reception strategies that are inherently more resistant to electromagnetic interference, allowing the system to leverage the awareness of EMI susceptibility to select appropriate testing parameters
Solution Approach 2:
The testing circuit changes key parameters such as signal frequency, amplitude, and measurement methodology when switching between testing modes. The first testing mode uses parameters optimized for high precision in low-EMI environments, while the second testing mode adjusts these parameters to be more resistant to electromagnetic interference, thereby maintaining measurement accuracy under varying electromagnetic conditions
3Measurement precision
If multiple testing modes are implemented, then the adaptability and measurement precision are improved, but the device complexity increases
Solution Approach 1:
Multiple testing modes are implemented within a unified testing circuit structure that can perform both high precision measurement and EMI-resistant measurement. The circuit uses shared components (test signal generator, receiver, processor) that can be configured for different measurement tasks, achieving multi-functionality that improves measurement precision without requiring completely separate testing systems
Solution Approach 2:
The testing circuit is segmented into distinct functional blocks (first test signal generator, second test signal generator, switch circuit, receiver, processor) that can be independently activated based on the selected testing mode. This segmentation allows the system to manage complexity by only activating the necessary components for each specific measurement task rather than maintaining all components active simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides adaptable testing that ensures high precision and EMI resistance, enabling accurate detection of cracks or defects in semiconductor devices under varying electromagnetic conditions.
Implementation Method 1
the test signal receiver is configured to generate a test result according to a voltage signal received from the first pad
Data Source
AI summary
Testing circuits and testing method are provided. The testing circuit includes a first pad, a second pad, a first test signal generator, a second test signal generator, a switch circuit, and a test signal receiver. The first and second pads are to be respectively coupled across the conductive ring structure. The first test signal generator is coupled to the first pad and configured to provide a first test signal to the first pad. The second test signal generator is coupled to the second pad and configured to provide a second test signal to the second pad. The switch circuit is configured to control the first test signal generator and the second test signal generator to provide the first and second test signals respectively in a first and second modes. The test signal receiver is configured to generate a test result according to a voltage signal received from the first pad.