Display Panel Cut-Line Structure for Crack-Resistant Shaping

The patent applies preliminary action by pre-configuring crack dams and stress relief grooves in the motherboard structure before cutting operations. These preventive features are built into the rigid substrate during manufacturing, allowing multiple cut lines to be used for different display panel shapes without causing cracks, as the crack dams and grooves proactively mitigate stress concentration at cut line locations.

The patent implements preliminary action by pre-forming crack dams and stress relief grooves in the rigid substrate before any cutting operations. These features are integrated into the motherboard structure during manufacturing, enabling precise cutting along multiple possible cut lines for personalized display panel shapes without the risk of crack formation that would compromise cutting precision.

The patent applies segmentation by dividing the crack prevention mechanism into distinct functional elements: crack dams that block crack propagation and stress relief grooves that reduce stress concentration. These segmented features are strategically placed at specific locations along cut lines in the motherboard structure, providing versatile cutting options while maintaining manageable structural complexity through modular design.