Display Panel Dam Structure for Oxygen and Moisture Protection

The patent applies a tapered dam insulating film structure specifically at the dam area where the encapsulation layer extends, creating local structural optimization. The film thickness gradually decreases from the insulating film surface toward the top, reducing stress concentration at this critical location while maintaining encapsulation coverage for moisture and oxygen protection

The tapered dam insulating film structure serves as a preventive measure before the encapsulation layer is fully formed. By pre-designing the reduced thickness region in the dam area, the structure cushions against future stress concentration that would otherwise cause cracks during device operation or thermal cycling

Rather than uniformly increasing the dam insulating film thickness throughout, the patent applies local quality by creating a tapered structure where the film thickness varies spatially. The thicker base provides support while the gradually thinning top region reduces stress concentration, optimizing both crack resistance and stress distribution

The patent changes the thickness parameter of the dam insulating film from a constant value to a gradient value. The thickness transitions from a larger value at the base to a smaller value at the top, creating a parameter gradient that simultaneously provides mechanical support and reduces stress concentration at the critical dam area