Display Panel Detection Circuit for Bonding State Verification
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Solution Overview
Problem
Display panels often suffer from defects such as line defects and dot defects during manufacturing processes like bonding gate and source driving circuits, aging, and packaging, which are not effectively detected or addressed by existing technologies.
Innovation Solution
A detection circuit and driving method for display panels that include a first pin group for connecting a gate driving circuit, a second pin group for bonding a second gate driving circuit, and a third pin group for connecting a source driving circuit, utilizing detection transistors and switching transistors to detect the connecting and driving states of these circuits, with detection circuits transmitting signals to determine the bonding and driving states through control and detection signal terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple detection circuits are integrated into the display panel to detect bonding and driving states, then defect detection capability is improved, but device complexity increases
Solution Approach 1:
The detection circuits are designed to perform multiple functions: detecting bonding states of gate driving circuits, detecting driving states of pixel circuits, and identifying defect types. A single detection circuit structure handles various detection tasks through different detection transistors and signal paths, reducing the need for separate dedicated circuits for each detection function.
Solution Approach 2:
The detection system is divided into multiple independent detection circuits, each responsible for specific detection tasks (bonding state detection, driving state detection). Each detection circuit contains specific detection transistors (first detection transistor, second detection transistor, third detection transistor) that can be independently activated based on detection needs, allowing modular operation and reducing overall system complexity.
2Manufacturing precision
If detection circuits are added to detect bonding states of gate driving circuits, then manufacturing quality control is improved, but manufacturing process complexity increases
Solution Approach 1:
The detection circuits are integrated into the display panel during the manufacturing process, enabling bonding state detection to be performed automatically as part of the manufacturing workflow. The detection transistors and signal paths are pre-configured to detect bonding states of gate driving circuits at specific manufacturing stages, eliminating the need for separate manual inspection processes.
3Adaptability or versatility
If multiple pin groups are used for connecting driving circuits, then adaptability of the display panel is improved, but device complexity increases
Solution Approach 1:
The multiple pin groups (first pin group, second pin group, third pin group) are designed with universal functionality to connect different types of driving circuits (first gate driving circuit, second gate driving circuit, source driving circuit). Each pin group can accommodate different driving circuit configurations, providing adaptability while using a standardized connection architecture that reduces overall system complexity.
Data Source
AI summary
Provided is a detection circuit and a driving method thereof, and a display panel. The detection circuit includes: a plurality of first detection circuits, a plurality of second detection circuits, and a plurality of third detection circuits. The first detection circuit is connected to a first pin, a first control signal terminal, a first detection signal terminal, and a first gate line corresponding to the first detection circuit; the second detection circuit is connected to a second pin, a second control signal terminal, a second detection signal terminal, and a second gate line corresponding to the second detection circuit; the third detection circuit is connected to a first data line corresponding to the third detection circuit, a sensing signal line corresponding to the third detection circuit, a third detection signal terminal, and a third control signal terminal.