Display Panel Carrier Substrate Separation via Differential Adhesive Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display panel manufacturing methods face challenges in efficiently separating carrier substrates without damaging the liquid crystal panel, often resulting in adhesive layer stress concentration and potential damage during the separation process, especially when using identical adhesive forces for both substrates.
Innovation Solution
The method involves using different adhesive forces for the first and second intermediate layers, with the first intermediate layer being weaker than the second, allowing for sequential and controlled separation of carrier substrates using a vacuum detachment device, ensuring the second intermediate layer remains on the substrate post-separation, thus preventing damage to the liquid crystal panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If identical adhesive forces are used for both intermediate layers, then the manufacturing process is simplified, but adhesive layer stress concentration occurs during carrier substrate separation causing potential damage to the liquid crystal panel
Solution Approach 1:
The patent applies different adhesive forces locally to different intermediate layers. The first intermediate layer has a first adhesive force while the second intermediate layer has a second adhesive force that is different from the first. This local differentiation allows the weaker layer to separate first during carrier substrate removal, preventing stress concentration on the liquid crystal panel while maintaining manufacturing feasibility.
2Ease of manufacture
If the same material is used for both intermediate layers, then material selection is simplified, but sequential separation of carrier substrates cannot be achieved
Solution Approach 1:
The patent specifies that the first and second intermediate layers are made of different materials to achieve different adhesive forces. The first intermediate layer material is selected to provide a first adhesive force, while the second intermediate layer material provides a second adhesive force. This material differentiation enables controlled sequential separation where the carrier substrate separates from the first substrate before separating from the second substrate, improving operational control.
3Reliability
If additional processes like ITO deposition are added for electrostatic discharge prevention, then panel protection is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent makes the intermediate layers serve dual functions: they provide adhesive bonding between carrier substrates and display substrates, and they provide electrostatic discharge protection. By selecting materials with appropriate adhesive forces and electrical properties, the intermediate layers protect the liquid crystal panel from electrostatic damage during the separation process without requiring additional ITO deposition or other separate protection processes, thereby maintaining manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of damage to the display panel during carrier substrate separation and eliminates the need for additional processes like ITO deposition for electrostatic discharge prevention, enhancing the manufacturing efficiency and panel integrity.
Implementation Method 1
an adhesive force of the first intermediate layer being weaker than an adhesive force of the second intermediate layer
Implementation Method 2
allowing for sequential and controlled separation of carrier substrates using a vacuum detachment device
Data Source
AI summary
A method of manufacturing a display panel, the method including attaching a first carrier substrate to a first substrate; attaching a second carrier substrate to a second substrate; forming a thin film transistor (TFT) array on the first substrate; forming a color filter (CF) array on the second substrate; and coupling the first substrate with the second substrate to provide coupled first and second substrates, the first substrate being bonded to the first carrier substrate with a first intermediate layer therebetween, the second substrate being bonded to the second carrier substrate with a second intermediate layer therebetween, and an adhesive force of the first intermediate layer being weaker than an adhesive force of the second intermediate layer.