Display Panel Driver IC Bonding Area Reduction
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Solution Overview
Problem
Conventional display panels face challenges in increasing the screen occupation ratio due to the non-reducible areas such as GOA and IC opposite side areas, limiting the reduction of the driver IC bonding area.
Innovation Solution
The integration of the driver IC into an external structure, with metal traces connecting the integrated circuit in the non-display area to this external structure, reduces the area occupied by the driver IC, allowing for a higher screen occupation ratio by utilizing a chip on film (COF) structure and a glass substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the non-display area is reduced to increase display area, then the screen occupation ratio is improved, but the electrical connection pathways become insufficient
Solution Approach 1:
The flexible circuit board extends the electrical connection pathways into the Z-dimension and utilizes the lateral space of the flexible circuit board itself. This allows metal traces to route signals externally around the display area rather than consuming non-display area on the substrate, effectively decoupling display area from connection pathway requirements.
Solution Approach 2:
The patent segments the electrical connection function from the substrate by implementing it on the flexible circuit board. The substrate focuses solely on display functions while the flexible circuit board handles signal routing and driver IC integration, allowing each component to be optimized independently for its specific function.
2Area of stationary object
If the driver IC is integrated into the external structure, then the driver IC bonding area on the substrate is reduced, but the complexity of external bonding structure increases
Solution Approach 1:
The flexible circuit board with COF structure performs multiple functions simultaneously: it serves as the driver IC carrier, provides electrical connection pathways, enables signal routing, and facilitates the external integration of the driver IC. This multi-functional design consolidates what would otherwise require separate components, reducing overall system complexity despite the external bonding arrangement.
Data Source
AI summary
Provided is a display panel, comprising a substrate, and a display area and a non-display area formed on the substrate; wherein metal traces are disposed on one side of the non-display area to electrically connect an integrated circuit in the non-display area with an external structure integrated with a driver integrated circuit (IC) for driving the integrated circuit in the non-display area by the external structure integrated with the driver IC to illuminate the display area. By bonding the driver IC to the external structure, the area ratio of the bonding area of the driver IC on the display panel is reduced to increase the screen occupation ratio of the display panel.