Bottom Emission Display Panel Driver Placement
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Solution Overview
Problem
Tiled display devices with large bezel or non-display regions reduce image quality due to perceived boundaries between display devices, affecting the overall screen experience.
Innovation Solution
A display device design where the panel driver is disposed on the encapsulation layer, electrically connected to the pixel circuit through via lines that penetrate the encapsulation layer, allowing for a bottom emission type display with reduced non-display region area, thereby minimizing the visibility of boundaries between display devices in a tiled setup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the panel driver is disposed in the non-display region adjacent to the display region, then the pixel circuit can be electrically connected to the panel driver, but the area of the non-display region increases causing visible boundaries in tiled display devices
Solution Approach 1:
The panel driver is moved from the lateral non-display region to the vertical dimension by disposing it on the encapsulation layer above the light emitting element. This spatial repositioning allows electrical connection through via lines penetrating the encapsulation layer, effectively utilizing the vertical dimension to reduce the horizontal non-display region area.
Solution Approach 2:
The panel driver is nested above the light emitting element structure, with the via lines penetrating through the encapsulation layer to establish electrical connection. This nested arrangement integrates the panel driver within the vertical stack of the display device, minimizing the lateral footprint and reducing the non-display region area.
2Area of stationary object
If the panel driver is disposed on the encapsulation layer overlapping the light emitting element, then the non-display region area is reduced, but the via line must penetrate the encapsulation layer requiring additional structural complexity
Solution Approach 1:
The via lines are formed to penetrate the encapsulation layer in the vertical dimension, establishing electrical connection between the pixel circuit on the substrate and the panel driver on the encapsulation layer. This vertical through-connection approach enables compact integration while managing the structural complexity through standardized via formation processes.
3Ease of manufacture
If the light emitting element overlaps the pixel circuit, then the electrical connection is straightforward, but the non-display region area increases reducing image quality
Solution Approach 1:
The light emitting element is positioned to overlap the pixel circuit in the vertical dimension rather than requiring lateral separation. This vertical stacking arrangement allows the light emitting element to be disposed above the pixel circuit with via lines providing electrical connection, thereby reducing the horizontal non-display region area while maintaining ease of manufacture through standard layer formation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances image quality by reducing the non-display region area and eliminating the perception of boundaries between display devices, enabling a seamless large screen experience in tiled display devices.
Implementation Method 1
a panel driver disposed on the encapsulation layer and that is electrically connected to the pixel circuit through a via line that penetrates the encapsulation layer
Implementation Method 2
a light emitting element connected to the pixel circuit and that emits light toward the substrate
Implementation Method 3
the common electrode reflects light
Data Source
AI summary
A display device includes, a substrate, a pixel circuit disposed on the substrate, a light emitting element connected to the pixel circuit and, that emits light toward the substrate, an encapsulation layer that covers the light emitting element, and a panel driver disposed on the encapsulation layer and electrically connected to the pixel circuit through a via line that penetrates the encapsulation layer.