Narrow-bezel Display Panel Driving Chip Nesting
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Solution Overview
Problem
The challenge in increasing the screen ratio of mobile phone panels using the chip-on-glass (COG) process is the difficulty in reducing the lower border area due to the space required for the driving chip and flexible circuit board, which hinders further narrowing of the panel.
Innovation Solution
A narrow-bezel display panel design featuring a driving chip with an accommodating region for the flexible circuit board, allowing the flexible-circuit-board fan-out area to be disposed within the driving chip, thereby reducing the lower border size and increasing the screen ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the driving chip and flexible circuit board are bonded to the lower border using COG process, then the panel can be driven and controlled, but the lower border size increases, reducing the screen ratio
Solution Approach 1:
The flexible circuit board is received and accommodated within the driving chip structure. The driving chip includes an accommodating region that houses the flexible circuit board, allowing the FPC to be nested inside the chip rather than extending outward. This nesting arrangement integrates both components into a compact unit, significantly reducing the lower border area while maintaining electrical connection and panel driving functionality.
Solution Approach 2:
The driving chip and flexible circuit board are merged into a single integrated structure. The FPC is bonded to the driving chip and received within its accommodating region, combining two previously separate components into one unified assembly. This merging eliminates the need for separate mounting spaces for both the driving chip and FPC, thereby reducing the overall lower border area and increasing the screen ratio.
2Area of stationary object
If the screen ratio is increased, then the display area and visual experience are improved, but the lower border must be narrowed, creating space constraints for mounting components
Solution Approach 1:
The flexible circuit board is received and accommodated within the driving chip structure. The driving chip includes an accommodating region that houses the flexible circuit board, allowing the FPC to be nested inside the chip rather than extending outward. This nesting arrangement integrates both components into a compact unit, significantly reducing the lower border area while maintaining electrical connection and panel driving functionality.
Solution Approach 2:
The driving chip and flexible circuit board are merged into a single integrated structure. The FPC is bonded to the driving chip and received within its accommodating region, combining two previously separate components into one unified assembly. This merging eliminates the need for separate mounting spaces for both the driving chip and FPC, thereby reducing the overall lower border area and increasing the screen ratio.
Data Source
AI summary
A narrow-bezel display panel includes a display region, a lower border, a driving chip, and a flexible circuit board. The lower border is connected to the display region. The driving chip is placed in the lower border. The flexible circuit board is arranged in the lower border and electrically connected to the driving chip. The driving chip is provided with an accommodating region toward the flexible circuit board, and the accommodating region receives one end of the flexible circuit board. Accordingly, a size of the lower border of the display panel is reduced.