Display Panel Dummy Bonding Pads for Flexible Circuit Retention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing display panels suffer from a small contact area between the flexible circuit board and the display substrate, leading to potential detachment of the flexible circuit board.
Innovation Solution
The addition of dummy bonding pads on the display substrate and corresponding dummy gold fingers on the flexible circuit board, increasing the contact area between the two components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the number of bonding pads is kept small to maintain a narrow border, then the screen-to-body ratio increases, but the contact area between the flexible circuit board and display substrate decreases, causing the flexible circuit board to be easily pulled out
Solution Approach 1:
The bonding interface is segmented into two functional zones: real bonding pads for electrical connection and dummy bonding pads for mechanical reinforcement. This segmentation allows the contact area to be expanded without adding unnecessary electrical connections, solving the contradiction between narrow border requirements and sufficient contact area.
Solution Approach 2:
Dummy bonding pads are created as copies of real bonding pads, replicating their geometric structure and bonding interface characteristics. These copied structures provide additional mechanical support without requiring additional electrical functionality, thereby increasing contact area while maintaining design simplicity.
2Strength
If more bonding pads are added to increase contact area, then the pulling force of the flexible circuit board increases, but the number of bonding pads on opposite sides of the chip becomes large, complicating the device structure
Solution Approach 1:
Different regions of the bonding interface are assigned different functions: real bonding pads located near the chip provide electrical connectivity, while dummy bonding pads located away from the chip provide mechanical strength. This local differentiation allows optimization of each region's properties without compromising the other, increasing pulling force without unnecessarily complicating the overall structure.
Solution Approach 2:
The solution extends the bonding interface in the spatial dimension by adding dummy bonding pads along the flexible circuit board's length. This dimensional extension increases the total contact area and pulling force without increasing the complexity at any single location, as the additional pads are distributed along the existing structure.
3Area of stationary object
If dummy bonding pads and dummy gold fingers are added to increase contact area, then the pulling force increases, but the device structure becomes more complex
Solution Approach 1:
The dummy bonding pads and dummy gold fingers are merged into the existing bonding pad and gold finger structures, sharing the same fabrication process and material layers. This merging approach increases contact area while minimizing additional structural complexity, as the dummy elements are integrated into the conventional bonding interface design.
Data Source
AI summary
The present application discloses a display panel and a display device. The display panel includes a display substrate and a flexible circuit board, and further including: a chip disposed on the display substrate on a side of a display area; bonding pads disposed on the display substrate and located on at least one of left and right sides of the chip; and virtual bonding pads disposed on the display substrate on a side of the bonding pads.