Display Panel Encapsulation Layout for Crack-Resistant Edge Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing display panels face challenges in enhancing their strength, particularly in the encapsulation region, which affects their performance and service life.
Innovation Solution
The display panel design includes a dielectric layer with N encapsulation sub-regions arranged sequentially, where the contact area between the first encapsulation sub-region and the encapsulant is smaller than other sub-regions, allowing for stress buffering and distribution, preventing stress accumulation and potential cracks near the display region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the encapsulation region is designed with uniform bonding force distribution, then the manufacturing process is simple, but stress accumulates at the side of the encapsulant facing the display region causing cracks
Solution Approach 1:
The encapsulation region is divided into multiple encapsulation sub-regions (first, second, third, and fourth encapsulation sub-regions) with different bonding forces. The first and second encapsulation sub-regions have smaller contact areas between the dielectric layer and encapsulant, creating weaker bonding forces, while the third and fourth encapsulation sub-regions have larger contact areas, creating stronger bonding forces. This segmentation allows stress to be buffered and distributed away from the display region, preventing crack formation.
Solution Approach 2:
Different regions of the encapsulation structure are assigned different bonding force characteristics. The first and second encapsulation sub-regions adjacent to the display region have reduced bonding forces (through smaller contact areas) to serve as stress buffering zones, while the third and fourth encapsulation sub-regions farther from the display region have stronger bonding forces (through larger contact areas) to provide stable encapsulation. This local differentiation optimizes stress distribution throughout the encapsulation structure.
2Strength
If the contact area between the dielectric layer and encapsulant is increased throughout the encapsulation region, then the bonding force is strengthened, but stress accumulates near the display region leading to cracks
Solution Approach 1:
The contact area between the dielectric layer and encapsulant is locally varied across different encapsulation sub-regions. The first and second encapsulation sub-regions have smaller contact areas to reduce bonding forces and create stress buffering zones, while the third and fourth encapsulation sub-regions have larger contact areas to strengthen bonding. This local quality differentiation ensures that stress is distributed away from the display region while maintaining adequate bonding strength in non-critical areas.
Solution Approach 2:
The encapsulation region is segmented into four distinct sub-regions with progressively varying contact areas. This segmentation creates a gradient of bonding forces that allows stress to be gradually buffered and distributed throughout the encapsulation structure, preventing sudden stress concentration and crack formation while still providing sufficient overall bonding strength.
Data Source
AI summary
A display panel and a display device. The display panel includes a display region and a non-display region including an encapsulation region, and an encapsulant is disposed in the region between a dielectric layer and a cover plate opposite to each other. The dielectric layer in the encapsulation region includes N encapsulation sub-regions, in which a 1st encapsulation sub-region is closest to the display region among the encapsulation sub-regions, and an Nth encapsulation sub-region is farthest from the display region among the encapsulation sub-regions. A contact area between at least the first encapsulation sub-region and the encapsulant is smaller than the contact area between any other encapsulation sub-region and the encapsulant.