Display Panel Embedded LED Transfer Without Eutectic Welding
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Solution Overview
Problem
The mass transfer technology for small-size light-emitting devices faces significant challenges, particularly in the high precision and stability required for transferring light-emitting elements from an original substrate to a driving substrate, where existing eutectic welding methods are complex and costly.
Innovation Solution
A display panel design where a light-emitting element is embedded in an organic insulating layer on a base substrate, allowing for alignment bonding without the need for eutectic welding, using pyrolysis adhesives and pre-curing techniques to ensure precise embedding and electrical connectivity through lapping electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If eutectic welding technology is used for mass transfer of light-emitting elements, then transfer reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the light-emitting element from the traditional eutectic welding process by embedding it directly into the organic insulating layer. This eliminates the need for complex eutectic welding equipment and processes while maintaining transfer reliability through direct embedding and alignment bonding.
Solution Approach 2:
The patent replaces expensive eutectic welding equipment and flux materials with a simpler organic insulating layer that serves as both the embedding medium and bonding interface. This substitution significantly reduces manufacturing cost and process complexity while achieving the same functional result.
2Manufacturing precision
If eutectic welding is performed in vacuum or inert gas environment, then welding quality is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent removes the requirement for vacuum or inert gas environment by using the organic insulating layer as the bonding medium. The alignment bonding process occurs in ambient conditions, eliminating complex environmental control systems while maintaining bonding quality.
Solution Approach 2:
The organic insulating layer serves as an intermediary substance that enables bonding between the light-emitting element and substrate without requiring controlled atmospheric conditions. This intermediary material provides both mechanical support and electrical insulation properties.
3Reliability
If traditional mass transfer process is used, then electrical connectivity is achieved, but substrate thickness increases
Solution Approach 1:
The patent embeds the light-emitting element within the organic insulating layer, creating a nested structure where the element is integrated into the substrate architecture. This eliminates the need for separate bonding layers and reduces overall substrate thickness while maintaining electrical connectivity through direct contact.
Solution Approach 2:
The patent transitions from a planar bonding approach to a three-dimensional embedding structure. The light-emitting element is positioned within the thickness of the organic insulating layer rather than being bonded to the surface, optimizing space utilization and reducing overall device thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and economizes the light-emitting element mass transfer process, enhancing efficiency and yield while maintaining high transfer precision, eliminating the need for eutectic welding and reducing substrate thickness.
Implementation Method 1
pre-curing the organic insulating layer, wherein the pre-curing temperature is from 100° C. to 120° C., and the pre-curing time is from 90 s to 150 s
Implementation Method 2
heating the pyrolysis adhesives to lose adhesion, so that the alignment substrate is separated
Data Source
AI summary
The present application discloses a display panel and a preparation method thereof. The display panel includes a base substrate provided with a circuit area and a light-emitting area; a driving circuit located in the circuit area of the base substrate; an organic insulating layer covering the light-emitting area of the base substrate; a light-emitting element embedded in the organic insulating layer, where an overlap area between the orthographic projection of the light-emitting element on the base substrate and the orthographic projection of the driving circuit on the base substrate is 0; and a first lapping electrode located on the side, facing away from the base substrate, of the light-emitting element, where the light-emitting element is electrically connected to the driving circuit through the first lapping electrode.