Display Panel Encapsulation via Organic Layer Removal
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Solution Overview
Problem
The challenge in fabricating display panels is achieving satisfactory encapsulation of organic layers in both the display and component installation areas, particularly due to the open mask process that deposits organic layers in both areas, leading to issues with sealing and preventing moisture and carbon dioxide ingress.
Innovation Solution
A method involving forming organic layers on a base substrate, removing them in specific regions of the component installation area, forming an encapsulating material layer, and curing it to create a sealed encapsulating structure that prevents moisture and carbon dioxide entry, using techniques like laser curing and forming absorbent layers to manage decomposed materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If organic layers are formed in both display area and component installation area using open mask process, then manufacturing efficiency is improved, but encapsulation difficulty increases due to inability to seal component installation area
Solution Approach 1:
The component installation area is divided into a first region (where organic layers are removed and encapsulated) and a second region (where organic layers are retained). This segmentation allows differential treatment of regions, enabling encapsulation of the first region while maintaining organic layers in the second region, thus resolving the encapsulation difficulty without sacrificing manufacturing efficiency
Solution Approach 2:
Different regions of the component installation area are given different properties: the first region undergoes organic layer removal and encapsulation to prevent moisture ingress, while the second region retains organic layers for functional purposes. This local differentiation allows each region to be optimized for its specific requirements
2Reliability
If encapsulating material layer is formed over organic layers in component installation area, then sealing is improved, but organic layers decompose and generate moisture and carbon dioxide
Solution Approach 1:
Organic layers are selectively removed from the first region of the component installation area before forming the encapsulating material layer. This extraction eliminates the source of moisture and carbon dioxide generation in the encapsulated region, allowing the encapsulating material to be cured without generating harmful decomposition products
Solution Approach 2:
The organic layers are removed from the first region before the encapsulating material layer is formed and cured. This preliminary action prevents the decomposition issue from occurring in the first region, while the second region retains organic layers for functional purposes
3Manufacturing precision
If laser curing is used to cure encapsulating material layer, then curing precision is improved, but absorbent layer is required to manage decomposed materials
Solution Approach 1:
An absorbent layer is formed on the base substrate before depositing the encapsulating material layer. This preliminary action prepares the structure to handle any decomposition products that may occur during laser curing, allowing precise curing while managing potential harmful effects
Solution Approach 2:
The absorbent layer acts as an intermediary between the laser curing process and the encapsulating material layer. It captures and manages decomposition products generated during laser curing, allowing the curing process to proceed with high precision while preventing harmful effects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively extends the lifespan of organic layers by preventing moisture and carbon dioxide ingress, ensuring the structural integrity and longevity of the display panel.
Implementation Method 1
curing the encapsulating material layer, wherein the curing of the encapsulating material layer is performed by laser curing
Implementation Method 2
removing the one or more organic layers in at least a first region of the component installation area comprises sintering the one or more organic layers in the first region of the component installation area is performed by laser sintering
Implementation Method 3
forming an absorbent layer for absorbing a decomposed material during sintering in at least the first region
Data Source
AI summary
A method of fabricating a display panel having a display area and a component installation area substantially surrounded by the display area. The method includes forming one or more organic layers on a base substrate in both the display area and the component installation area; removing the one or more organic layers in at least a first region of the component installation area; forming an encapsulating material layer in at least the first region of the component installation area; and curing the encapsulating material layer.