Display Panel Encapsulation Structure for Smooth Wiring-Hole Etching
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Solution Overview
Problem
The steep tilt angle in the encapsulation layer of display panels during manufacturing leads to metal residues and internal short circuits, reducing the reliability and performance of the display panel.
Innovation Solution
A display panel design with varying thicknesses of the encapsulation layer, including a first encapsulation portion with a greater thickness near the display area and a second portion with a lesser thickness, and an etched groove to reduce the tilt angle, ensuring smooth etching and improved sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the encapsulation layer has a large tilt angle at the position between the display area and the bonding area, then the encapsulation layer transitions steeply in this area, but metal residues occur during etching process, leading to short circuit problems
Solution Approach 1:
The patent applies local quality by creating different thickness regions within the encapsulation layer. The first region has a first thickness and the second region has a second thickness that is greater than the first thickness. This local variation in thickness allows the encapsulation layer to have a gentler tilt angle in critical areas, preventing metal residues during etching while maintaining effective encapsulation in other areas.
Solution Approach 2:
The patent changes the thickness parameter of the encapsulation layer to resolve the contradiction. By increasing the thickness in the second region compared to the first region, the tilt angle is effectively reduced in the bonding area, enabling successful etching processes without metal residues that would cause short circuits.
2Shape
If the encapsulation layer has a large tilt angle, then the encapsulation layer transitions steeply, but the flatness of the formed layer is poor
Solution Approach 1:
The patent implements local quality by differentiating the encapsulation layer into regions with different thicknesses. The second region has greater thickness than the first region, creating a more gradual transition and improving flatness in areas where metal wirings are formed, while maintaining the necessary encapsulation profile in other areas.
3Shape
If the encapsulation layer has a steep transition, then the tilt angle is large, but etching process produces metal residues
Solution Approach 1:
The patent changes the thickness parameter of the encapsulation layer to optimize the etching process. By making the second region thicker than the first region, the tilt angle is reduced, allowing the etching process to proceed without leaving metal residues, thereby improving etching quality while maintaining the encapsulation layer's protective function.
Data Source
Figure 1~2B
Figure 3
AI summary
A display panel and a display device are provided in the embodiments of the present invention, the display panel comprising a substrate, an inorganic insulating layer, an organic insulating layer, a light emitting layer and an encapsulation layer, wherein the organic insulating layer comprises an organic insulating portion, and the encapsulation layer covers at least part of the organic insulating portion and does not extend to a first wiring hole of the organic insulating layer. By using different etching processes to form etched grooves of the encapsulation layer on side surfaces or top surfaces of the film layers, the etching effect and overall performance of the display panel are effectively improved.