Display Panel Peripheral Wires Fan-Out Side Surfaces Narrow Bezel
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Solution Overview
Problem
Current display panel technologies face challenges in achieving a narrow bezel design while maintaining high image quality and resolution, as the increasing number of wires in the peripheral circuit region complicates the layout and requires thicker substrates, which is unfavorable for thin displays.
Innovation Solution
The display panel design features alternating and evenly spaced first and second peripheral wires with fan-out portions on opposite substrates, reducing the layout area and allowing for a narrow bezel by separating the fan-out portions on limited thickness substrates, thereby minimizing the width of the peripheral region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of wires in the peripheral circuit region is increased to meet higher image quality and resolution requirements, then the image quality is improved, but the bezel width increases and it becomes difficult to achieve a narrow bezel design
Solution Approach 1:
The fan-out portions of the peripheral wires are moved from the planar surface to the side surfaces of the substrates, transitioning the wiring layout from two-dimensional to three-dimensional space. This allows wires to extend vertically along the substrate thickness direction, reducing the horizontal space required in the peripheral circuit region and enabling narrower bezels while maintaining the necessary wiring capacity for high-resolution displays
2Measurement precision
If the number of wires in the peripheral circuit region is increased to accommodate higher resolution displays, then the resolution is improved, but the layout area increases and substrate thickness must be increased
Solution Approach 1:
By utilizing the side surfaces and thickness direction of substrates for wire routing, the patent transforms the layout problem from a two-dimensional area constraint to a three-dimensional volume utilization problem. The fan-out portions extend along the substrate thickness, allowing more wires to be accommodated without increasing the planar layout area, thus supporting higher resolutions while maintaining compact form factors
3Device complexity
If fan-out portions are disposed on the same surface of a substrate, then the wiring connections are simplified, but the layout area increases and narrow bezel design becomes difficult
Solution Approach 1:
The patent divides the fan-out portions into separate groups disposed on different side surfaces of the substrate. By segmenting the wiring connections across multiple surfaces rather than concentrating them on a single surface, the design reduces the peripheral circuit region width required on each surface, enabling narrow bezel implementation while maintaining all necessary wiring connections through the combined three-dimensional routing structure
Data Source
AI summary
A display panel includes a first substrate, a second substrate, a display medium layer, first peripheral wires, and second peripheral wires. The first substrate has at least one first side surface. The second substrate is disposed opposite to the first substrate, and has at least one second side surface adjacent to the first side surface. Each first peripheral wire includes a first signal line, a first fan-out portion, and a first pad. The first signal lines are disposed between the first substrate and the second substrate, and the first fan-out portions are disposed on the first side surface of the first substrate. Each second peripheral wire includes a second signal line, a second fan-out portion, and a second pad. The second signal lines are disposed between the first substrate and the second substrate, and the second fan-out portions are disposed on the second side surface of the second substrate.