Display Panel Frame Width Reduction via Bridge Wire Stacking
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Solution Overview
Problem
Current display panels with high screen-to-body ratios have a large frame width due to the placement of drive chips and fan-out leads, which affects the overall design and functionality of terminal devices.
Innovation Solution
The display panel design includes a first and second display region, with the pixel drive circuit and signal lines restricted to the first display region, and the use of bridge wires and fan-out leads optimized to reduce the frame width by retracting the pixel drive circuit and distributing fan-out leads efficiently across the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the drive chip and fan-out lead are disposed in the frame region of the display panel, then the drive chip can be connected to the pixel drive circuit, but the frame width on the side where the drive chip is bound becomes large
Solution Approach 1:
The pixel drive circuit is retracted from the conventional planar arrangement to a stacked configuration where the pixel drive circuit is positioned above the substrate. This vertical dimensionality change allows the fan-out lead to extend horizontally along the substrate surface while connecting to the pixel drive circuit in the vertical dimension, thereby reducing the frame width without compromising the electrical connection.
2Reliability
If the pixel drive circuit is disposed in both the first display region and the second display region, then the pixel drive circuit can be connected to light-emitting components across the display region, but the fan-out lead size in the fan-out region increases
Solution Approach 1:
The pixel drive circuit function is extracted from the second display region and relocated to the first display region with vertical stacking. This extraction eliminates the need for fan-out leads to extend across the entire display region, as the pixel drive circuit is now positioned closer to the light-emitting components it serves, thereby reducing the fan-out lead size and optimizing the fan-out region layout.
3Length of stationary object
If the frame width is reduced by retracting the pixel drive circuit, then the screen-to-body ratio is improved, but the complexity of the bridge wire layer and via holes increases
Solution Approach 1:
The bridge wire layer is extended into the vertical dimension with via holes penetrating through insulation layers to connect the pixel drive circuit above the substrate to the light-emitting components on the substrate surface. This three-dimensional wiring approach consolidates the interconnections, allowing for a more compact horizontal layout and reduced frame width despite the increased vertical complexity.
Data Source
AI summary
A display panel and a terminal device in the field of terminal technologies. A light-emitting component is disposed in each of a first display region and a second display region of the display panel, and a pixel drive circuit and a signal line are disposed only in the first display region, so that each pixel drive circuit is connected to the light-emitting component by using a bridge wire. Therefore, when the signal line in the first display region is connected to a drive chip by using a fan-out lead, a size of the fan-out lead located in a fan-out region can be reduced in a direction from a display region to a binding region, thereby reducing a frame width on a first side of the display panel.