Display Panel Grooves for Moisture Barrier Protection
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Solution Overview
Problem
Organic light emitting display panels are vulnerable to moisture and oxygen infiltration, leading to potential defects and reduced reliability.
Innovation Solution
A display panel design featuring a base substrate with recessed regions, a barrier layer with openings, and a circuit layer with insulating layers, including inorganic and organic layers, to create a protective structure around the module hole and prevent moisture and oxygen ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic light emitting elements are used in display panels, then low power consumption and fast reaction speed are achieved, but the elements become vulnerable to moisture and oxygen infiltration causing defects
Solution Approach 1:
The patent implements a multi-layer encapsulation structure where inorganic barrier layers are nested within an organic encapsulation layer. The organic encapsulation layer serves as an outer protective shell, while inorganic layers provide internal barrier protection. This nested configuration creates a hierarchical defense system that effectively blocks both moisture and oxygen from reaching the organic light emitting elements, directly resolving the vulnerability to harmful factors while maintaining the low power consumption and fast response benefits of organic light emitting technology.
Solution Approach 2:
The patent employs a composite encapsulation structure combining organic and inorganic materials. The organic encapsulation layer provides flexibility and outer protection, while inorganic barrier layers contribute superior moisture and oxygen blocking properties. This composite approach leverages the complementary strengths of both material types to achieve enhanced reliability against environmental factors, solving the infiltration problem without compromising the electrical performance characteristics of the display panel.
2Reliability
If a multi-layer encapsulation structure is implemented to prevent moisture and oxygen infiltration, then reliability is improved, but device complexity increases
Solution Approach 1:
The encapsulation system is segmented into distinct functional layers: an outer organic encapsulation layer and inner inorganic barrier layers. Each segment performs a specific protective function, with the organic layer providing outer protection and the inorganic layers providing barrier protection. This segmentation allows for modular fabrication and simplifies the manufacturing process compared to a single complex barrier layer, while achieving enhanced reliability through distributed protective functions.
Solution Approach 2:
The organic encapsulation layer acts as an intermediary between the external environment and the inorganic barrier layers. It provides a protective interface that prevents direct exposure of the inorganic layers to moisture and oxygen, while also serving as a structural foundation for the inorganic barrier layers. This intermediary approach simplifies the overall structure by providing a unified protective system where the organic layer mediates the interaction between environmental factors and the sensitive organic light emitting elements.
Data Source
AI summary
A display panel includes a peripheral region adjacent to a display region. The display region includes a hole peripheral region, and a recessed region is overlapped with the hole peripheral region. The display panel also includes a barrier layer with a penetrating opening overlapped with the recessed region, a circuit layer on the barrier layer and including a transistor and insulating layers, and a device layer including an organic light emitting area coupled to the circuit layer. In addition, a module hole is overlapped with the hole peripheral region and penetrates the base substrate, and a first groove is overlapped with the hole peripheral region and corresponds to a portion of the base substrate that is recessed from a top surface of the barrier layer and that encloses the module hole. The insulating layers include inorganic layers and an organic layer having side portions enclosing the module hole.