Display Panel Heat Dissipation Members for Driver IC Cooling
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Solution Overview
Problem
Existing display devices face challenges in heat dissipation, which degrades image quality and durability due to heat generated by integrated circuits, and require improved structures for protecting circuit films and printed circuit boards during assembly and disassembly.
Innovation Solution
The display device incorporates first and second heat dissipation members coupled to the rear surface of the display panel to support and protect circuit films and printed circuit boards, facilitating detachment and attachment while enhancing heat dissipation performance through convective processes and thermal conductivity materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If integrated circuits are mounted on circuit films or PCBs to enable display device functionality, then the device can perform driving and control operations, but heat is generated that degrades image quality and deteriorates durability
Solution Approach 1:
The patent extracts the heat-generating integrated circuits from the main display panel structure by mounting them on separate PCBs that are detachably connected to the panel. This separation allows the heat sources to be removed from the panel assembly, preventing heat-related degradation of image quality and component durability while maintaining full driving and control functionality.
2Reliability
If circuit films and PCBs are firmly fixed to the display panel to ensure stable electrical connections, then reliability of connections is improved, but detachment and attachment during assembly and disassembly become difficult
Solution Approach 1:
The patent implements a dynamic connection system where PCBs are detachably mounted to the display panel using spring-loaded contact members that automatically engage with corresponding connection terminals. This dynamic structure provides firm electrical connections during operation while enabling easy detachment and reattachment during assembly and disassembly, resolving the contradiction between connection reliability and operational ease.
3Temperature
If heat dissipation structures are added to protect circuit films and PCBs, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent designs PCBs that serve multiple functions: they provide electrical connections, mechanical support for integrated circuits, and heat dissipation pathways. The PCBs are made of heat-conductive materials and are thermally coupled to the display panel, allowing them to dissipate heat from mounted components while maintaining electrical connectivity and structural integrity, thereby improving heat dissipation without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces heat transmission to the display panel, improving image quality and durability by dissipating heat from driver ICs and internal components, as demonstrated by a noticeable temperature drop during testing.
Implementation Method 1
first and second heat dissipation members coupled to a rear surface of the display panel to support and protect circuit films, a PCB, and the like, while dissipating heat from driver ICs and the like
Implementation Method 2
improve heat dissipation performance for dissipating heat from driver integrated circuits (ICs) and the like
Data Source
AI summary
Circuit films, a printed circuit board (PCB), and the like, are connected to a display panel. First and second heat dissipation members are coupled to a rear surface of the display panel to support and protect the circuit films, the PCB, and the like, while dissipating heat from driver ICs and the like.